阵列基板周边设计对聚酰亚胺液扩散的影响

刘金贵; 殷盛杰; 顾可可; 李光强; 申名; 李啸; 杨妮; 许亨艺; 罗建勇

doi:10.3788/YJYXS20203503.0205

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阵列基板周边设计对聚酰亚胺液扩散的影响

材料与器件 | 更新时间：2020-08-12

- 阵列基板周边设计对聚酰亚胺液扩散的影响
- Effect of periphery design of TFT substrate on the diffusion of polyimide solution
- 液晶与显示 2020年35卷第3期页码：205-210
- 作者机构：
  
  重庆京东方光电科技有限公司, 重庆 400700
- 作者简介：
  
  [ "刘金贵(1988-), 男, 重庆渝北人, 硕士, 2015年于四川大学获得硕士学位, 主要从事面板段不良解析方面的工作。E-mail:liujingui@boe.com.cn" ]
  [ "李啸(1988-), 男, 四川南充人, 硕士, 高级工程师, 2014年毕业于北京理工大学获得硕士学位, 主要从事聚酰亚胺取向膜涂覆方面的研究。E-mail:lixiao_cq@boe.com.cn" ]
- 基金信息：
- DOI：10.3788/YJYXS20203503.0205
  中图分类号： TN.141.9
- 收稿日期：2019-10-08，
  
  修回日期：2019-11-12，
  
  录用日期：2019-11-12，
  
  纸质出版日期：2020-03-05
- 稿件说明：
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刘金贵, 殷盛杰, 顾可可, 等. 阵列基板周边设计对聚酰亚胺液扩散的影响[J]. 液晶与显示, 2020,35(3):205-210.

Jin-gui LIU, Sheng-jie YIN, Ke-ke GU, et al. Effect of periphery design of TFT substrate on the diffusion of polyimide solution[J]. Chinese journal of liquid crystals and displays, 2020, 35(3): 205-210.
刘金贵, 殷盛杰, 顾可可, 等. 阵列基板周边设计对聚酰亚胺液扩散的影响[J]. 液晶与显示, 2020,35(3):205-210. DOI： 10.3788/YJYXS20203503.0205.

Jin-gui LIU, Sheng-jie YIN, Ke-ke GU, et al. Effect of periphery design of TFT substrate on the diffusion of polyimide solution[J]. Chinese journal of liquid crystals and displays, 2020, 35(3): 205-210. DOI： 10.3788/YJYXS20203503.0205.

摘要

为提高产能，笔记本电脑超高级超维场开关（HADS）显示产品的聚酰亚胺（PI）膜涂布方式从滚筒涂布的感光树脂转印版（APR）转印变更为喷墨打印，涂布方式的变更造成了PI液滴在面板周边

com

过孔和走线密集处扩散困难，难以扩散的PI液滴在面板边缘聚集形成周边黑线不良。首先，通过变更PVX（passivation SiN

，钝化层）掩膜版解决

com

过孔周边PI液扩散不均问题，即通过改变面板周边过孔周期、尺寸以及距离像素区间距来减小过孔存在的影响，GP（Gate pad）侧过孔数量变为原来1/8，过孔面积比原来减小了98%，DP（Date pad）侧过孔数量变为原来的1/9，过孔面积比原来减小99%，同时DP侧过孔与像素区间距增大60%，PVX掩膜版变更极大地改善了PI液滴在过孔周围的扩散均匀性，最终周边黑线发生率从100%减小为6.6%。其次，通过变更喷墨打印涂布工艺来减小面板周边PI液积聚程度，我们开发出喷墨打印边缘补正功能，即保持像素区膜厚不变，面板边缘区域膜厚减少。边缘区域PI液的减少降低了该区域PI液积聚的可能性，边缘补正功能使得周边黑线发生率从6.6%降至0.5%。再次，阵列基板采用条形涂覆方式，即GP侧PI液全涂覆，周边黑线不良发生率降至0.05%。通过变更PVX掩膜版设计和喷墨打印涂布工艺参数，周边黑线不良发生率从100%减小为0.05%，满足量产需求。

Abstract

To improve the production capacity

the PI (polyimide) film coating method of High Advanced Dimension Switch (HADS) products is changed from APR transfer printing (Roller Coater) to inkjet printing(Inkjet Printer). The change of coating method causes the accumulation of polyimide (PI) solution near the

com

via

hole and

com

line which exists in the peripheral zone

which causes a failure named "peripheral black line". Firstly

we can solve the diffusion problem of PI solution by changing PVX (passivation SiN

) mask

that is

to reduce the influence of

via

hole by changing the cycle

size and distance between

via

hole and active area. we reduce the cycle of

com

via

hole near gate pad (GP) area by a factor of eight

the occupied area of

com

via

hole decreases by 98% than before. In the meanwhile

we reduce the cycle of

com

via

hole near date pad (DP) area by a factor of nine

the occupied area of

com

via

hole decreases by 99%

the distance between

via

hole of GP area and AA area increases by 60% than before. The changing of PVX mask greatly improves the diffusion of PI solution

eventually

the failure rate of black line reduces from 100% to 6.6%. Secondly

we develop an edge compensation function of inkjet printer to reduce the accumulation of PI solution in peripheral area

that is

the PI thickness of peripheral area is half the active area

the reduction of PI solution in the EM area reduces the possibility of accumulation in the area

and then the failure rate of black line reduces from 6.6% to 0.5%. Thirdly

we change the coating mode from pattern coating to strip-type coating

that is

the GP area is filled with PI solution in all area

which reduces the failure rate from 0.5% to 0.05%. By changing the PVX mask design and process parameters of Inkjet printer

the incidence of peripheral black line defects are reduced from 100% to 0.05%

meeting the mass production needs.

关键词

Keywords

references

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