基于有限元的Mini-LED灭灯分析

刘硕; 吴仁杰; 杨贤; 刘阳; 马可; 朱红丽; 周昊; 孙海威

doi:10.3788/YJYXS20203501.0053

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基于有限元的Mini-LED灭灯分析

材料与器件 | 更新时间：2020-07-05

- 基于有限元的Mini-LED灭灯分析
- Analysis of Mini-LED light-off phenomenon based on FEM simulation
- 液晶与显示 2020年35卷第1期页码：53-61
- 作者机构：
  
  北京京东方显示技术有限公司, 北京 100176
- 作者简介：
  
  刘硕(1992-), 男, 河北石家庄人, 硕士, 工程师, 2017年于北京交通大学获得硕士学位, 主要从事LCD显示模组的设计及产品开发研究。E-mail:lius@boe.com.cn
- 基金信息：
- DOI：10.3788/YJYXS20203501.0053
  中图分类号： TP394.1;TH691.9
- 收稿日期：2019-04-03，
  
  修回日期：2019-06-18，
  
  录用日期：2019-6-18，
  
  纸质出版日期：2020-01-05
- 稿件说明：
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刘硕, 吴仁杰, 杨贤, 等. 基于有限元的Mini-LED灭灯分析[J]. 液晶与显示, 2020,35(1):53-61.

Shuo LIU, Jen-chieh WU, Xian YANG, et al. Analysis of Mini-LED light-off phenomenon based on FEM simulation[J]. Chinese journal of liquid crystals and displays, 2020, 35(1): 53-61.
刘硕, 吴仁杰, 杨贤, 等. 基于有限元的Mini-LED灭灯分析[J]. 液晶与显示, 2020,35(1):53-61. DOI： 10.3788/YJYXS20203501.0053.

Shuo LIU, Jen-chieh WU, Xian YANG, et al. Analysis of Mini-LED light-off phenomenon based on FEM simulation[J]. Chinese journal of liquid crystals and displays, 2020, 35(1): 53-61. DOI： 10.3788/YJYXS20203501.0053.

摘要

Mini-LED背光模组具有精准的局域控光能力且可实现超薄HDR显示，目前其已成为显示行业研究热点之一。针对Mini-LED在点灯过程中发生的灭灯现象，从灯板制作工艺入手，探讨了灭灯现象发生的机理。并基于有限元模拟方法，结合灯板制作工艺、灯板结构等实际情况合理建立了Mini-LED模组仿真模型，模型仿真温度值与实测值对比误差在5%以内。将灯板在高温试验条件下极限状态温度场导入力学仿真模块进行力学模拟，获得极限状态下的热应力值大小及分布，并进一步推算出芯片所受最大推力值。将芯片所受推力值模拟结果与实测结果进行对比后，发现模拟结果位于实测结果的上下四分位数之间，且大于实测结果平均值，符合实际情况。基于模拟结果，改善了芯片锡膏，在芯片最大推力提高15%的情况下，实测芯片推力值的下四分位数值大于模拟值，且Mini-LED灭灯的发生概率从1.13×10

-4

降低到了1×10

-5

以下，改善效果明显。

Abstract

On account of its thinner display module and accurate local dimming ability

the Mini-LED technology has become a popular research direction in display field. Aiming at the lighting-off phenomenon through the light board aging process

the reason and mechanism of the lighting-off phenomenon is explored beginning with the manufacture process of the LED board. Based on the FEM simulation method

combined with the manufacture process and the structure of the Mini-LED light board

the simulation model is established reasonably

and the temperature simulation results showed the error of the model is within 5% compared with the measured results. In order to get the thermal stress field of the light board under extreme situation

the simulation result of the light board temperature field under high temperature operation is imported into the mechanics simulation. Compared with the measured results

the simulation result of the maximum chip thrust is between the upper quartile and the lower quartile

and is bigger than the average value of the measured results

which show the simulation is accord with the actual situation. The solder paste is developed based on the simulation

and the result shows that the probability of the light-off phenomenon is reduced to under 1×10

-5

from 1.13×10

-4

when the maximum chip thrust is increased by 15%

which shows the improvement effect is obvious.

关键词

Keywords

references

吴诗聪 . Mini-LED:助力下一轮LCD技术发展 . 光电子技术 , 2018 . 38 ( 3 ): 145 - 148 . http://d.old.wanfangdata.com.cn/NSTLQK/NSTL_QKJJ0225985507/ http://d.old.wanfangdata.com.cn/NSTLQK/NSTL_QKJJ0225985507/ .

S T WU . Mini-LED:Next round of LCD evolution . Optoelectronic Technology , 2018 . 38 ( 3 ): 145 - 143 . http://d.old.wanfangdata.com.cn/NSTLQK/NSTL_QKJJ0225985507/ http://d.old.wanfangdata.com.cn/NSTLQK/NSTL_QKJJ0225985507/ .

G J TAN , Y G HUANG , M C LI , 等 . High dynamic range liquid crystal displays with a mini-LED backlight . Optics Express , 2018 . 26 ( 13 ): 16572 - 16584 . DOI: 10.1364/OE.26.016572 http://doi.org/10.1364/OE.26.016572 .

H CHEN , J SUNG , T HA , 等 . Locally pixel-compensated backlight dimming for improving static contrast on LED back-lit LCDs . SID Symposium Digest of Technic Papers , 2007 . 38 ( 1 ): 1339 - 1342 . DOI: 10.1889/1.2785560 http://doi.org/10.1889/1.2785560 .

文尚胜 , 陈建龙 , 陈颖聪 , 等 . 基于共晶焊接工艺和板上封装技术的大功率LED热特性分析 . 半导体光电 , 2014 . 35 ( 4 ): 589 - 610 . http://d.old.wanfangdata.com.cn/Periodical/bdtgd201404006 http://d.old.wanfangdata.com.cn/Periodical/bdtgd201404006 .

S S WEN , J L CHEN , Y C CHEN , 等 . Thermal analysis of high power LED eutectic welding process and COB packaging technology . Semiconductor of Optoelectronics , 2014 . 35 ( 4 ): 589 - 610 . http://d.old.wanfangdata.com.cn/Periodical/bdtgd201404006 http://d.old.wanfangdata.com.cn/Periodical/bdtgd201404006 .

刘双喜. LED片式COB光源的加速寿命试验及失效分析[D].武汉: 华中科技大学, 2016.

LIU S X. Accelerated Life Test and failure analysis of LED plate COB light source[D]. Wuhan: Huazhong University & Technology, 2016. (in Chinese)

崔栋 , 韩锐 , 马青 , 等 . 5寸车载高亮模组散热分析与应用 . 液晶与显示 , 2017 . 32 ( 10 ): 765 - 771 . http://yjyxs.com/CN/abstract/abstract10227.shtml http://yjyxs.com/CN/abstract/abstract10227.shtml .

D CUI , R HAN , Q MA , 等 . Thermal analysis and application of 5 in automotive high luminance module . Chinese Journal of Liquid Crystal and Displays , 2017 . 32 ( 10 ): 765 - 771 . http://yjyxs.com/CN/abstract/abstract10227.shtml http://yjyxs.com/CN/abstract/abstract10227.shtml .

雷嗣军 , 马青 , 尹大根 , 等 . 基于TRIZ理论的LED背光源散热研究 . 液晶与显示 , 2012 . 27 ( 1 ): 56 - 60 . http://yjyxs.com/CN/abstract/abstract9045.shtml http://yjyxs.com/CN/abstract/abstract9045.shtml .

S J LEI , Q MA , D K YOON , 等 . Heat dissipation of LED back light units based on TRIZ . Chinese Journal of Liquid Crystal and Displays , 2012 . 27 ( 1 ): 56 - 60 . http://yjyxs.com/CN/abstract/abstract9045.shtml http://yjyxs.com/CN/abstract/abstract9045.shtml .

王江 , 连军红 , 谢成洪 . 回流焊对铁支架SMD LED产品的可靠性影响 . 电子工业专用设备 , 2016 . 45 ( 11 ): 29 - 33, 42 . DOI: 10.3969/j.issn.1004-4507.2016.11.008 http://doi.org/10.3969/j.issn.1004-4507.2016.11.008 .

J WANG , J H LIAN , C H XIE . The research on the reliability of lron frame SMD LED . Equipment for Electronic Products Manufacturing , 2016 . 45 ( 11 ): 29 - 33, 42 . DOI: 10.3969/j.issn.1004-4507.2016.11.008 http://doi.org/10.3969/j.issn.1004-4507.2016.11.008 .

赵健. PCB组件热-力分析的有限元模型及仿真[D].天津: 天津大学, 2016.

ZHAO J. The finite element modeling and simulation for thermomechanical analysis of PCBA[D]. Tianjin; Tianjin University, 2006. (in Chinese)

杨世铭 , 陶文铨 . 传热学 , 高等教育出版社 , 2006 .

S M YANG , W S TAO . Heat Transfer , Higher Education Press , 2006 .

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