IC绑定对TDDI结构触控不良的影响

朱磊; 王忠俊; 黄式强; 李盼盼; 胡伟; 林汇哲

doi:10.3788/YJYXS20193408.0764

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IC绑定对TDDI结构触控不良的影响

材料与器件 | 更新时间：2020-12-14

- IC绑定对TDDI结构触控不良的影响
- Influence of IC bonding on touch abnormal of TDDI structure
- 液晶与显示 2019年34卷第8期页码：764-771
- 作者机构：
  
  重庆京东方光电科技有限公司, 重庆 400700
- 作者简介：
  
  [ "朱磊(1990-), 男, 河南三门峡人, 硕士, 高级研究员, 2014年于武汉理工大学获得硕士学位, 主要从事液晶显示方面的研究。E-mail:leizhu@boe.com.cn" ]
- 基金信息：
- DOI：10.3788/YJYXS20193408.0764
  中图分类号： TN141.9
- 收稿日期：2019-03-11，
  
  录用日期：2019-4-19，
  
  纸质出版日期：2019-08-05
- 稿件说明：
移动端阅览
朱磊, 王忠俊, 黄式强, 等. IC绑定对TDDI结构触控不良的影响[J]. 液晶与显示, 2019,34(8):764-771.

Lei ZHU, Zhong-jun WANG, Shi-qiang HUANG, et al. Influence of IC bonding on touch abnormal of TDDI structure[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 764-771.
朱磊, 王忠俊, 黄式强, 等. IC绑定对TDDI结构触控不良的影响[J]. 液晶与显示, 2019,34(8):764-771. DOI： 10.3788/YJYXS20193408.0764.

Lei ZHU, Zhong-jun WANG, Shi-qiang HUANG, et al. Influence of IC bonding on touch abnormal of TDDI structure[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 764-771. DOI： 10.3788/YJYXS20193408.0764.

摘要

为了减少触摸屏生产过程中以及客户端触控不良的发生，提高良率，本文研究了IC绑定对触控与显示驱动器集成（Touch and Display Driver Integration，TDDI）结构触控不良的影响。首先，利用新思IC厂商开发的容值测试软件进行测试，根据测试结果确认触控不良的种类；其次进行IC交叉验证，根据测试结果确认显示屏还是IC存在问题。研究结果表明，各向异性导电膜（Anisotropic Conductive Film，ACF）胶厚度较厚造成了IC绑定粒子变形小，接触面积较小，导致了较大的接触电阻，出现触控不良。通过更换厚度较薄的ACF胶，不良得到改善，模组厂不良发生率从3.935×10

-3

降低至8.38×10

-4

，客户端不良率从1.5×10

-3

降低至0。通过变更ACF胶厚度，改善IC绑定粒子状态，可以有效减少触控不良的发生。

Abstract

In order to reduce the occurrence of touch abnormal in the production process and client-side

improve the yield

the influence of IC bonding on touch abnormal of TDDI(Touch and Display Driver Integration) structure was studied in this paper. Firstly

Synaptics IC manufacturer's capacitance testing results was used to identify the types of touch abnormal. Then

which had problems

the panel or IC was to be confirmed according to the IC cross validation results. The results show that the IC bonding particles have small deformation and contact area due to the ACF thickness

and it causes greater contact resistance and touch abnormal. The defect ratio is improved by replacing a thinner ACF

and it is decreased from 3.935×10

-3

to 8.38×10

-4

in module factory and decreased from 1.5×10

-3

to 0 in customer. Improving the state of IC binding particles can effectively reduce the occurrence of TP fail by changing the thickness of ACF.

关键词

Keywords

references

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