OLED金属走线弯折过程裂纹扩展有限元分析

张博; 廖敦明; 刘正周; 滕子浩; 吴棣; 陈继峯; 林书如

doi:10.3788/YJYXS20183305.0427

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OLED金属走线弯折过程裂纹扩展有限元分析

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- OLED金属走线弯折过程裂纹扩展有限元分析
- Finite element analysis of crack growth of metal line in bending process of OLED panel
- 液晶与显示 2018年33卷第5期页码：427-432
- 作者机构：
  
  1.华中科技大学材料科学与工程学院, 湖北武汉 430074
  2.武汉华星光电半导体显示技术有限公司, 湖北武汉 430078
- 作者简介：
  
  [ "张博(1995-), 男, 甘肃定西人, 硕士研究生, 主要从事扩展有限元裂纹仿真分析方面的研究。E-mail:zhangbo95@hust.edu.cn" ]
  [ "廖敦明(1973-), 男, 湖南隆回人, 博士, 教授, 博士生导师, 主要研究领域为材料成形数字化。E-mail:liaodunming@hust.edu.cn" ]
- 基金信息：
  
  教育部新世纪优秀人才支持计划(NCET-13-0229);国家杰出青年基金(NSFC51725504);the Program for New Century Excellent Talents in University(NCET-13-0229);National Science Fund for Distinguished Young Scholars(NSFC51725504)
- DOI：10.3788/YJYXS20183305.0427
  中图分类号： O346.1;TN873
- 收稿日期：2018-01-28，
  
  录用日期：2018-3-5，
  
  纸质出版日期：2018-05
- 稿件说明：
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张博, 廖敦明, 刘正周, 等. OLED金属走线弯折过程裂纹扩展有限元分析[J]. 液晶与显示, 2018,33(5):427-432.

Bo ZHANG, Dun-ming LIAO, Zheng-zhou LIU, et al. Finite element analysis of crack growth of metal line in bending process of OLED panel[J]. Chinese journal of liquid crystals and displays, 2018, 33(5): 427-432.
张博, 廖敦明, 刘正周, 等. OLED金属走线弯折过程裂纹扩展有限元分析[J]. 液晶与显示, 2018,33(5):427-432. DOI： 10.3788/YJYXS20183305.0427.

Bo ZHANG, Dun-ming LIAO, Zheng-zhou LIU, et al. Finite element analysis of crack growth of metal line in bending process of OLED panel[J]. Chinese journal of liquid crystals and displays, 2018, 33(5): 427-432. DOI： 10.3788/YJYXS20183305.0427.

摘要

针对OLED面板COF（Chip on Film）连接过渡区在弯折过程中易发生金属走线断裂的问题，本文对金属走线中裂纹的扩展机理以及抑制裂纹扩展的方法进行了研究。基于复合材料界面裂纹偏转与穿透理论分析了金属走线与有机光阻界面处的裂纹扩展方式，比较了两种金属走线结构在裂纹扩展过程中的应力强度因子变化。仿真结果表明，金属走线与有机光阻的裂纹倾向于沿垂直走线的方向扩展，裂纹沿着界面扩展的趋势很小。对比两种不同金属走线（环状与条状）的应力强度因子发现，环状金属走线内部靠近孔处的应力强度因子降低了95%，能有效抑制金属走线中的裂纹扩展。

Abstract

Aiming at the problem that the metal lines breakage easily occurs during the bending process of COF connection transition zone in the OLED panel

the mechanism of crack propagation and the way to inhibit the crack propagation in the metal line are studied. Based on the theory of interface crack deflection and penetration

the mode of crack growth at the interface between metal line and organic photoresist is analyzed. The change of stress intensity factor of the two metal line during crack growth is compared. The simulation results show that the main path of crack propagation in the pad bending area is perpendicular to the metal lines. The tendency of propagation along the interface between the metal traces and the organic photoresist is very small. Through the calculation of stress intensity factor of the two structures

it can be found that the stress intensity factor near the inner hole of the annular metal line is reduced by 95% with respect to that of striped metal line. Thus the hole of the annular metal line effectively suppresses crack propagation.

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