基于ANSYS液晶玻璃基板的应力分析

刘洋; 胡亮; 洪性坤; 朱载荣; 桂继维; 陈栋; 王维维; 聂学政; 章亭

doi:10.3788/YJYXS20183303.0188

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基于ANSYS液晶玻璃基板的应力分析

材料与器件 | 更新时间：2020-07-06

- 基于ANSYS液晶玻璃基板的应力分析
- Stress analysis of LCD glass substrate based on ANSYS
- 液晶与显示 2018年33卷第3期页码：188-194
- 作者机构：
  
  福州京东方光电科技有限公司, 福建福州 350000
- 作者简介：
  
  [ "刘洋(1990-), 男, 安徽阜阳人, 硕士, 工程师, 2016年于中南大学获得硕士学位, 现任职于福州京东方光电科技有限公司, 主要从事液晶面板制造Assy工艺的研究。E-mail:liuyangfz@boe.com.cn" ]
  [ "胡亮(1985-), 男, 北京人, 硕士, 资深高级工程师, 2010年于北京航空航天大学获得硕士学位, 现任职于福州京东方光电科技有限公司, 主要从事液晶面板制造成盒工艺的研究。E-mail:huliang@boe.com.cn" ]
- 基金信息：
- DOI：10.3788/YJYXS20183303.0188
  中图分类号： O348.7
- 收稿日期：2017-09-08，
  
  录用日期：2017-10-30，
  
  纸质出版日期：2018-03-05
- 稿件说明：
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刘洋, 胡亮, 洪性坤, 等. 基于ANSYS液晶玻璃基板的应力分析[J]. 液晶与显示, 2018,33(3):188-194.

Yang LIU, Liang HU, Xing-kun HONG, et al. Stress analysis of LCD glass substrate based on ANSYS[J]. Chinese journal of liquid crystals and displays, 2018, 33(3): 188-194.
刘洋, 胡亮, 洪性坤, 等. 基于ANSYS液晶玻璃基板的应力分析[J]. 液晶与显示, 2018,33(3):188-194. DOI： 10.3788/YJYXS20183303.0188.

Yang LIU, Liang HU, Xing-kun HONG, et al. Stress analysis of LCD glass substrate based on ANSYS[J]. Chinese journal of liquid crystals and displays, 2018, 33(3): 188-194. DOI： 10.3788/YJYXS20183303.0188.

摘要

为了管控紫外光固化工艺过程掩膜版的裂纹，基于ANSYS对受石英棒吸附的液晶玻璃基板的结构应力及升降温过程的热应力进行仿真分析，讨论了不同材料和不同厚度玻璃基板的结构应力及热应力变化。结构应力分析结果表明，基板挠度、等效应力和弯曲应力最大值均出现在中部；基板厚度增加时，最大应力值显著减小。热应力分析结果表明，当玻璃基板存在温度梯度时，升温较大的区域，玻璃基板挠度更大；随着温度先增大后减小，玻璃基板挠度、等效应力与弯曲应力均先增大后减小，且升降温过程中基板应力变化显著，等效应力变化最大，弯曲压应力变化较小，弯曲拉应力变化最小。玻璃基板等效应力和弯曲拉应力最大值分别达到44.8 MPa和5.79 MPa。优化设备降温系统，降低玻璃基板各区域的温度梯度与基板升温值等可有效防止玻璃破裂的发生。

Abstract

Structural stress and thermal stress of LCD glass substrate absorbed by quartz-rod was studied by numerical method. The change of glass structure stress and thermal stress of different material and different thickness glass was discussed. The results of structural stress analysis show that the maximum deflection

equivalent stress and bending stress are in the middle of glass. When the thickness of the substrate increases

the maximum stress value decreases significantly. The thermal stress analysis shows that when the glass substrate has a temperature gradient

the glass substrate is more deflected with the larger heated area. With the decrease of the temperature

the deflection

equivalent stress and bending stress of the glass substrate are increased first

then the stress of the substrate is significant in the process of cooling. As the temperature increases after the first decreases

the deflection

equivalent stress and bending stress of glass substrate firstly increases then decreases

and the substrate stress changes significantly in the process

equivalent stress changes most

bending compressive stress changes smaller

bending tensile stress changes smallest. The maximum values of the equivalent stress and bending stress of glass substrate are 44.8 MPa and 5.79 MPa respectively. Reducing the temperature gradient and the heating value of the glass substrate can effectively prevent the glass cracking.

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references

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