LTPS工艺中光刻胶与膜层粘附力的研究

剧永波; 陈建军; 张宸铭; 简月圆; 熊正平; 张龙泉; 赵东升; 罗少先; 刘昊; 孙宏伟; 白贺鹏

doi:10.3788/YJYXS20173203.0190

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LTPS工艺中光刻胶与膜层粘附力的研究

材料与器件 | 更新时间：2020-07-07

- LTPS工艺中光刻胶与膜层粘附力的研究
- Photoresist and film adhesive force in LTPS process
- 液晶与显示 2017年32卷第3期页码：190-195
- 作者机构：
  
  1.鄂尔多斯市源盛光电有限责任公司, 内蒙古鄂尔多斯 017000
  2.京东方科技集团股份有限责任公司, 北京 100176
- 作者简介：
  
  剧永波(1984-),男,山西朔州人,工程师,主要从事LTPS产品生产及工艺技术的研究工作。E-mail：juyongbo@boe.com.cn
- 基金信息：
- DOI：10.3788/YJYXS20173203.0190
  中图分类号： TP394.1;TH691.9
- 收稿日期：2016-09-22，
  
  录用日期：2016-10-11，
  
  纸质出版日期：2017-03
- 稿件说明：
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剧永波, 陈建军, 张宸铭, 等. LTPS工艺中光刻胶与膜层粘附力的研究[J]. 液晶与显示, 2017,32(3):190-195.

Yong-bo JU, Jian-jun CHEN, Chen-ming ZHANG, et al. Photoresist and film adhesive force in LTPS process[J]. Chinese journal of liquid crystals and displays, 2017, 32(3): 190-195.
剧永波, 陈建军, 张宸铭, 等. LTPS工艺中光刻胶与膜层粘附力的研究[J]. 液晶与显示, 2017,32(3):190-195. DOI： 10.3788/YJYXS20173203.0190.

Yong-bo JU, Jian-jun CHEN, Chen-ming ZHANG, et al. Photoresist and film adhesive force in LTPS process[J]. Chinese journal of liquid crystals and displays, 2017, 32(3): 190-195. DOI： 10.3788/YJYXS20173203.0190.

摘要

本文对影响LTPS工艺中光刻胶和衬底间粘附力的4个因素进行了实验及理论分析。经实验发现：衬底的材质和粗糙度以及光刻胶中分子量的分布是影响光刻胶和衬底粘附力的最重要的两个因素。在改善粘附力方面HMDS对于电负性较强的金属衬底和光刻胶的粘附力有较好的改善效果，对于SiN

、A-Si及P-Si衬底改善效果明显，且无差异，对于ITO没有改善。光刻胶涂布后适当延长烘烤时间也可以有效改善光刻胶和衬底的粘附力。

Abstract

In this paper

four factors have been experimented and analyzed theoretically

which will influence the adhesion between photoresist and the substrate in LTPS process. It is found that the substrate material and roughness and the molecular weight distribution in the photoresist are the two most important factors that affect the adhesion between photoresist and the substrate. In terms of improving adhesion

HMDS makes better performance in improving the adhesion between strong electronegativity metal substrate and photoresist

while has obvious improvement effect in SiN

A-Si and P-Si substrate

and without any difference among them. But there is no improvement in ITO. Properly extending the baking time can also effectively improve the adhesion between photoresist and the substrate after the photoresist has been coated.

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references

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