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成都京东方光电科技有限公司设备技术部, 四川成都 611731
收稿日期:2015-01-15,
修回日期:2015-03-07,
纸质出版日期:2015-10-05
移动端阅览
周梁, 韩大伟, 孙泉钦, 王丹名, 李华, 陈垚. 一种实用的PECVD腔体检漏工具设计方法[J]. 液晶与显示, 2015,30(5): 813-818
ZHOU Liang, HAN David, SUN Quan-qin, WANG Dan-ming, LI Hua, CHEN Yao. Practical design method of PECVD cavity check-up tool[J]. , 2015,30(5): 813-818
周梁, 韩大伟, 孙泉钦, 王丹名, 李华, 陈垚. 一种实用的PECVD腔体检漏工具设计方法[J]. 液晶与显示, 2015,30(5): 813-818 DOI: 10.3788/YJYXS20153005.0813.
ZHOU Liang, HAN David, SUN Quan-qin, WANG Dan-ming, LI Hua, CHEN Yao. Practical design method of PECVD cavity check-up tool[J]. , 2015,30(5): 813-818 DOI: 10.3788/YJYXS20153005.0813.
在TFT-LCD行业
PECVD设备主要用于Array TFT基板工艺中的气相沉积;产生的非金属膜层
为金属电路提供保护、开关作用;在PECVD工艺制程中
腔体设计复杂
反应条件苛刻
产生的制程物会造成产品不良
故需要定期进行PM(pre maintenance预防性维护)。本文以PECVD PM作业为背景
针对设备PM耗时长的问题
制定了改善方法
并着重介绍了腔体检漏工具的设计过程。设计制作了一台国产化检漏工具
成功运用于量产。通过测试
检漏工具3 min内达到10 mT(1 mT=0.133 Pa)
漏率为0.45 mT/min
基本符合设备Spec.(标准)要求。
In TFT-LCD industry
PECVD equipment is mainly used for the vapor deposition in the process of Array TFT to produce non-metal film layer
which protects and switches metal circuit. In PECVD process
cavity design is complex and reaction conditions are harsh
the process will lead to bad products
so we need to do pre-maintenance on a regular basis. On the background of PECVD PM
we improved the method and emphatically introduced the cavity check-up leak tool design process because of the time-consuming of PM. We designed a domestic leak detection tool
and applied it into mass producing successfully. Final test results showed that pressure reached to 10 mT in 3 min and the leakage rate is 0.45 mT/min
which accord with the equipment standard.
谢振宇. A-Si TFT用氮化硅薄膜的制备及其性能研究[D].成都:电子科技大学,2007, 10:31-33. Xie Z Y. A - Si TFT made with thinfilm of silicon nitride and researched its properties[D]. Chengdu:University of electronic Science and Technology, 2007, 10:31-33.(in Chinese)[2] 陶涛,苏辉,谢自力,等.PECVD法氮化硅薄膜生长工艺的研究[J].微纳电子技术,2010, 19(5):223-228. Tao T, Su H, Xie Z L,et al. The research of growth process technique of Silicon nitride by PECVD[J]. Journal of Micro-nano Electronic Technology, 2010, 19(5):223-228.(in Chinese)[3] 张晓情,李沛林,王敬松,等. PECVD淀积Si3N4作为光刻掩膜版的保护膜[J].半导体技术,2009, 13:123-127. ZhangX Q, Li P L, Wang J S,et al. Si3N4 deposition by PECVD as the protective film of photolithography mask version[J].Semiconductor technology, 2009, 13:123-127.(in Chinese)[4] 翟军华,苏通.液晶面板制造业中制造执行系统的设计与实现[J].液晶与显示,2014, 29(3):60-64. ZHAI J H, Su T. Design and implementation of manufacturing execution system for TFT LCD manufacturing enterprises[J]. Chinese Journal of Liquid Crystals and Displays, 2014, 29(3):60-64.(in Chinese)[5] 王卫刚,周炳海.快速换模技术的实践研究[J].机床与液压,2007, 15(5):235-240. Wang W G, Zhou B H. The practice research of the fast changing mould technology[J]. Journal of Machine Tools and Hydraulic, 2007, 15(5):235-240.(in Chinese)[6] 姜波.真空检漏在维修中的应用[J].机械制造,2006, 17(3):323-330. Jiang B. The application of vacuum leak detected in maintenance[J]. Journal of Mechanical Manufacturing, 2006, 17(4):323-330.(in Chinese)[7] 唐柱才.冲击载荷下结构动态屈曲的数值研究[D].大连:大连理工大学,2004, 16(4):189-192. Tang Z.The dynamic buckling numerical studies of the structure under impact load[D]. Dalian:Dalian university of technology, 2004, 16(4):189-192.(in Chinese)[8] 刘洋.平板式PECVD设备布气系统的分析和优化[D].沈阳:东北大学,2009:64-67. Liu Y. The analysis and optimization for the gas system of the plate type PECVD equipment[D]. Shenyang:Northeastern university, 2009:64-67.(in Chinese)[9] 陈素君,杨静.真空镀膜设备真空系统主泵的配置[C].真空工程学术交流会,2009, 33:156-163. Chen S J, Yang J. The configuration of main pump of vacuum system for vacuum coating equipment[C]. Vacuum Engineering Academic Communication, 2009, 33:156-163. (in Chinese)[10] 陈素君.真空镀膜设备抽气系统的性能要求及主泵的选择[D].中国真空学会第六届全国会员代表大会暨学术会议论文摘要集,2004, 13:156-163. Chen S J. The performance requirements of extraction system for vacuum coating equipment and the selection of main pump.[C]. Member of Chinese vacuum society the sixth national congress and academic conference paper sets of, 2004, 13:156-163. (in Chinese)[11] 闫建云,张俊锋,李邵亮.介绍一种新型真空阀[J].中国铸造装备与技术,2007, 9:117-119. Yan J Y, Zhang J F, Li S L. The introduction of a new type of vacuum valves[J]. China Casting Equipment and Technology, 2007, 9:117-119.(in Chinese)[12] 陈同沛.新型的真空阀门与真空零部件[J].真空与低温,1988, 18(5):170-173. Chen T P. New types of vacuum valves and components[J]. Journal of Vacuum and Low Temperature, 1988, 18(5):170-173.(in Chinese)
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