彭毅雯, 徐伟, 罗毅, 等. TFT-LCD面影像残留改善研究[J]. 液晶与显示, 2012, 27(1):66-69. Peng Y W, Xue W, Luo Y, et al.Improvement of TFT-LCD area image sticking[J].Chinese Journal of Liquid Crystals and Displays, 2012, 27(1): 66-69.(in Chinese)[2] 万建武. 表面张力作用下的平行平板下填充流动模型研究[J], 广州大学学报:自然科学版, 2010, 9(5): 11-15. Wang J W.Study of underfill flow model between two parallel plates driven by capillary forces[J].Journal of Guangzhou University:Natural Science Edition, 2010, 9(5): 11-15. (in Chinese)[3] Wang J. Underfill of flip-chip on organic substrate: viscosity, surface tension and contact angle[J].Microelectronics Reliability, 2002, 42: 293-299.[4] Washburn E W. The dynamics of capillary flow[J].Physical Review, 1921, 17(3): 273-283.[5] Gamota D R, Melton C M.Advanced encapsulant materials systems for flip-chip-on-board assemblies. I. Encapsulant materials with improved manufacturing properties. Ⅱ. Materials to integrate the reflow and underfilling processes[C].Electronics Manufacturing Technology Symposium, Austin, 1996:1-9.[6] Pascarella N W, Baldin D F.Compression flow modeling of underfill encapsulation for low cost flip-chip assembly[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 1998, 21(4): 325-335.[7] Han S, Wang K K.Analysis of the flow of encapsulant during underfill encapsulation of flip-chips[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 1997, 20 (4): 424-433.[8] Schwiebert M K, Leong W H.Underfill flow as viscous flow between parallel plates driven by capillary action[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 1996, 19(2): 133-137.[9] 丁祖荣.流体力学[M].北京:高等教育出版社, 2004:16-22. Ding Z R. Hydromechanics [M].Beijing:Higher Education Press, 2004: 16-22.(in Chinese)[10] 吴望一.流体力学[M].北京:北京大学出版社, 1982:161-170. Wu W Y.Hydromechanics[M].Beijing:Peking University Press, 1982:161-170. (in Chinese)