激光在显示器件绑定的应用研究

王莉莉; 刘超; 宋月胜; 汪楚航; 孙海威

doi:10.37188/YJYXS20203512.1258

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激光在显示器件绑定的应用研究

器件制备及检测 | 更新时间：2020-12-04

- 激光在显示器件绑定的应用研究
- Research of laser bonding for display device
- 液晶与显示 2020年35卷第12期页码：1258-1263
- 作者机构：
  
  京东方科技集团股份有限公司, 北京 100176
- 作者简介：
  
  [ "王莉莉(1988-), 女, 陕西延安人, 硕士, 高级研究员, 2014年于北京科技大学获得硕士学位, 主要从事显示器件模组设计和工艺研究。E-mail:wlili@boe.com.cn" ]
- 基金信息：
- DOI：10.37188/YJYXS20203512.1258
  中图分类号： TN141.9
- 收稿日期：2020-05-02，
  
  修回日期：2020-08-19，
  
  录用日期：2020-8-19，
  
  纸质出版日期：2020-12
- 稿件说明：
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王莉莉, 刘超, 宋月胜, 等. 激光在显示器件绑定的应用研究[J]. 液晶与显示, 2020,35(12):1258-1263.

Li-li WANG, Chao LIU, Yue-sheng SONG, et al. Research of laser bonding for display device[J]. Chinese journal of liquid crystals and displays, 2020, 35(12): 1258-1263.
王莉莉, 刘超, 宋月胜, 等. 激光在显示器件绑定的应用研究[J]. 液晶与显示, 2020,35(12):1258-1263. DOI： 10.37188/YJYXS20203512.1258.

Li-li WANG, Chao LIU, Yue-sheng SONG, et al. Research of laser bonding for display device[J]. Chinese journal of liquid crystals and displays, 2020, 35(12): 1258-1263. DOI： 10.37188/YJYXS20203512.1258.

摘要

随着显示技术的不断发展，全面屏显示愈发受到市场的欢迎和追捧。为了最大限度降低产品边框、提高显示产品的屏占比，本文研究了激光固化各向异性导电胶膜（Anisotropic Conductive Film，ACF）来实现显示器件绑定的新技术。通过对TFT的电极压痕、粒子形变量、ACF反应率、拉拔力和产品信赖性等测试，发现激光绑定是一项实际可行的显示器件绑定技术。本文进行了激光绑定技术优势验证，得到：（1）最小热损伤距离，相比较传统热压绑定技术，热损伤安全距离由0.75 mm降低至0.15 mm，极大地缩短了IC/COF到偏光片的距离，避免了偏光片烫伤内缩影响显示。（2）降低量产生产节拍时间，由于激光能量均匀集中，且直接加热ACF，使得ACF固化速度更快，在现有ACF条件下，本压时间可由5 s降低至3 s，大幅度加快生产节拍，提高产品的生产效率。可见，激光绑定既可以解决热压工艺瓶颈，实现极致窄边框显示器的绑定，又能降低生产节拍时间，提高生产效率，是一种非常有前途的新技术。

Abstract

With the continuous development of display technology

the comprehensive screen display has become highly sought-after by the market. In order to minimize the display border and improve the screen share of display products

a new technology of laser curing anisotropic conductive film (ACF) is studied to achieve the display bonding. Through the tests of TFT electrode indentation

particle deformation

ACF reaction rate

ACF die shear and product reliabilities

it is found that laser bonding is a viable bonding technology. In this paper

the experiments are designed to verify the advantages of laser bonding technology. Conclusions are as follows:(1)Compared with hotbar bonding technology

the safety distance of thermal is reduced from 0.75 mm to 0.15 mm

which greatly shortens the IC/COF to polarizer(POL) distance and avoids the shrinkage of POL scald. (2)Because of its concentrated laser beam and directly ACF cured

the main bonding time is reduced from 5 s to 3 s

which greatly speeds up the production takt time and improves the efficiency. All results show that laser bonding is a very promising new technology.

关键词

Keywords

references

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