基于低温多晶硅-氧化物半导体混合集成的薄膜晶体管显示背板技术

邓立昂; 陈世林; 黄博天; 郭小军

doi:10.37188/CJLCD.2020-0268

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基于低温多晶硅-氧化物半导体混合集成的薄膜晶体管显示背板技术

驱动与控制 | 更新时间：2021-03-23

- 基于低温多晶硅-氧化物半导体混合集成的薄膜晶体管显示背板技术
- TFT display backplane technology based on low-temperature polysilicon-oxide semiconductor hybrid integration
- 液晶与显示 2021年36卷第3期页码：420-431
- 作者机构：
  
  1.上海交通大学电子信息与电气工程学院, 上海 200240
  2.江苏省知识产权局, 江苏南京 210036
- 作者简介：
  
  [ "邓立昂(1997-), 男, 陕西西安人, 博士研究生, 2019年于西安电子科技大学获得学士学位, 主要从事基于薄膜晶体管的电路设计方面的研究。E-mail: lyon_deng@sjtu.edu.cn" ]
  [ "郭小军(1981-), 男, 江苏南通人, 博士, 教授, 2007年于Surrey大学获得博士学位, 主要从事薄膜晶体管和柔性电子集成方面的研究。E-mail: x.guo@sjtu.edu.cn" ]
- 基金信息：
  
  国家重点研发计划(2019YFA0706100);国家自然科学基金优秀青年科学基金(61922057)
- DOI：10.37188/CJLCD.2020-0268
  中图分类号： TP394.1;TN321.5
- 收稿日期：2020-10-09，
  
  录用日期：2020-11-16，
  
  纸质出版日期：2021-03
- 稿件说明：
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邓立昂, 陈世林, 黄博天, 等. 基于低温多晶硅-氧化物半导体混合集成的薄膜晶体管显示背板技术[J]. 液晶与显示, 2021,36(3):420-431.

Li-ang DENG, Shi-lin CHEN, Bo-tian HUANG, et al. TFT display backplane technology based on low-temperature polysilicon-oxide semiconductor hybrid integration[J]. Chinese journal of liquid crystals and displays, 2021, 36(3): 420-431.
邓立昂, 陈世林, 黄博天, 等. 基于低温多晶硅-氧化物半导体混合集成的薄膜晶体管显示背板技术[J]. 液晶与显示, 2021,36(3):420-431. DOI： 10.37188/CJLCD.2020-0268.

Li-ang DENG, Shi-lin CHEN, Bo-tian HUANG, et al. TFT display backplane technology based on low-temperature polysilicon-oxide semiconductor hybrid integration[J]. Chinese journal of liquid crystals and displays, 2021, 36(3): 420-431. DOI： 10.37188/CJLCD.2020-0268.

摘要

低温多晶硅-氧化物半导体混合集成(Low temperature polycrystalline silicon and oxide，LTPO)的薄膜晶体管(thin-film transistor，TFT)背板技术融合了低温多晶硅和氧化物半导体TFT两者的优势，为低功耗、高性能显示以及功能化集成提供了新的发展机遇，获得了产业界和学术界的广泛关注。本文系统地总结和分析了LTPO相关技术与应用的研究进展以及面临的技术挑战。首先，讨论了分别针对液晶显示(Liquid crystal display，LCD)和有机发光二极管(Organic light emitting diode，OLED)显示的LTPO背板的集成方式，进一步总结分析了实现LTPO集成的器件结构和工艺挑战。此外，针对有源矩阵OLED显示，分析了LTPO技术用于设计兼容低帧率和高帧率驱动、具有内部补偿功能的像素电路的优势，以及在超低帧率(如1 Hz)驱动情况下，TFT器件稳定性带来的影响和相关的补偿驱动方法。最后，对LTPO技术进一步发展的可能趋势进行了展望。

Abstract

Low temperature polycrystalline silicon and oxide (LTPO) thin-film transistor (TFT) backplane technology combines the advantages of both low temperature polycrystalline silicon and oxide semiconductor TFTs. It has received extensive attention from both industry and academia since it is promising for development of advanced displays with low power consumption

high performance and functional integration. This paper systematically summarizes and analyzes the research progress of technologies and applications related to LTPO and highlights the technical challenges. Firstly

the integration methods of LTPO backplanes for liquid crystal displays (LCDs) and organic light emitting diode (OLED) displays are discussed respectively. Then the challenges of device structures and processing methods for LTPO integration are further discussed. Meanwhile

the advantages of LTPO technology for designing pixel circuits to be compatible with both low and high frame rate driving are analyzed

as well as the internal compensation technologies. The impacts of TFT device stability and compensation methods for ultra-low frame rate (i.e. 1 Hz) driving are also included. Finally

the content of this paper is summarized

and the prospective trend of future LTPO technology is outlined.

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references

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