The triode-structure field emission display was a new vacuum flat display device
and the acquirement and maintenance of high-vacuum was one of necessary condition for the normal working display device. With the low-melting glass frit sintering process and glass spacer element
the high vacuum flat packaging for field emission display device was realized
and the packaging process including the device structure
device sintering
device exhausting and device getter-baking was improved. With the packaging technology
the triode-structure high-vacuum field emission display sample with carbon nanotube emitters was developed.
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references
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