组装工艺对ACF互连性能的影响

左建东; 罗超云

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组装工艺对ACF互连性能的影响

器件制备技术及器件物理 | 更新时间：2020-08-12

- 组装工艺对ACF互连性能的影响
- Effect of Packaging Technology of ACF on Interconnection Property
- 液晶与显示 2009年24卷第4期页码：537-540
- 作者机构：
  
  1. 深圳大学材料科学与工程学院
  2. 深圳职业技术学院应用化学与生物技术学院,广东深圳,518055
  3. 深圳市特种功能材料重点实验室,广东深圳 518060,E-mail: jdzuo@szu.edu.cn
- 作者简介：
- 基金信息：
- DOI：
  中图分类号： TN406;TN405.97
- 收稿日期：2009-01-08，
  
  修回日期：1900-01-02，
  
  网络出版日期：2009-08-30，
  
  纸质出版日期：2009-08-30
- 稿件说明：
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左建东;罗超云. 组装工艺对ACF互连性能的影响[J]. 液晶与显示, 2009,24(04): 537-540

ZUO Jian-dong;LUO Chao-yun. Effect of Packaging Technology of ACF on Interconnection Property[J]. 液晶与显示, 2009,24(04): 537-540
左建东;罗超云. 组装工艺对ACF互连性能的影响[J]. 液晶与显示, 2009,24(04): 537-540 DOI：

ZUO Jian-dong;LUO Chao-yun. Effect of Packaging Technology of ACF on Interconnection Property[J]. 液晶与显示, 2009,24(04): 537-540 DOI：

摘要

总结了异向导电胶膜(ACF)的组装工艺对ACF导电性能的影响。文献表明在ACF组装过程中

组装的温度、压头的压力和加热时间对ACF的固化程度有直接影响

进而影响到ACF互连的力学性能、电学性能和可靠性。合适的组装温度在180~200 ℃;不同的组装形式均有其最佳的组装压力;ACF胶的互连电阻在87％固化程度时最小;固化程度小于50%

出现短路的概率较大

达到25％;随着偏移程度的增加

ACF的互连电阻增加

导电粒子的形状对偏移产生的绝缘电阻影响更大。

Abstract

Effect of packing technology on the interconnection property of anisotropic conductive film (ACF) was discussed. The References showed that in the procession of packaging of ACF

pressure of discharge head

heat temperature and heat time have an important effect on the degree of curing. Moreover these parameters further affect the mechanical property

electric property and reliability of ACF. The appropriate packaging temperature is between 180 ℃ and 200 ℃

and the different packaging form has the optimal pressure. The resistance of ACF is minimal when the curing degree is 87%. When the curing degree is smaller than 50%

the probability of short circuit can reach 25%. The resistance of ACF increased as the offset improved. The shape of conductive particles has an important effect on insulation resistance caused by offset.

关键词

Keywords

references

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