Effect of panel <italic style="font-style: italic">via</italic> hole design on diffusion of polyimide solution

Jin-gui LIU; Sheng-jie YIN; Ke-ke GU; Guang-qiang LI; Ming SHEN; Xiao LI; Ni YANG; Yun-ze LI; Jian-yong LUO

doi:10.3788/YJYXS20203504.0321

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Effect of panel via hole design on diffusion of polyimide solution

Materials and Devices | 更新时间：2020-07-05

- Effect of panel via hole design on diffusion of polyimide solution
- Chinese Journal of Liquid Crystals and Displays Vol. 35, Issue 4, Pages: 321-327(2020)
- 作者机构：
  
  重庆京东方光电科技有限公司重庆, 400700
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20203504.0321
  CLC： TN.141.9
- Received：13 August 2019，
  
  Revised：30 September 2019，
  
  Accepted：30 September 2019，
  
  Published：05 April 2020
- 稿件说明：
移动端阅览
Jin-gui LIU, Sheng-jie YIN, Ke-ke GU, et al. Effect of panel via hole design on diffusion of polyimide solution[J]. Chinese journal of liquid crystals and displays, 2020, 35(4): 321-327.
DOI：

Jin-gui LIU, Sheng-jie YIN, Ke-ke GU, et al. Effect of panel via hole design on diffusion of polyimide solution[J]. Chinese journal of liquid crystals and displays, 2020, 35(4): 321-327. DOI： 10.3788/YJYXS20203504.0321.

摘要

为提高产能，笔记本电脑超高级超维场开关（HADS）产品的聚酰亚胺（PI）膜涂布方式从辊涂的感光树脂转印版（APR版）转印变更为喷墨打印，涂布方式的变更造成了PI液滴无法填充到高段差钝化层（PVX）过孔内，进而在过孔周围PI液堆积产生宏观"线Mura"不良。我们通过变更产品设计与工艺参数调整以及工艺过程优化，设法降低或消除不良产品，使良率满足量产需求。首先，通过变更钝化层掩膜版使得钝化层过孔和Com走线有一定偏移量（钝化层半过孔），半过孔设计利于PI液通过半过孔缺口设计进入钝化层过孔内。为了减小钝化层过孔尺寸和数量对PI液扩散的不利影响，钝化层过孔周期从1/3变更为1/6，过孔尺寸从5.7 μm增大到7.5 μm。钝化层掩膜版设计的变更极大改善了PI液进入过孔内，将"线Mura"不良率从100%降为15%。其次，从提高PI液滴涂布均匀性方向出发，将喷墨打印涂布方式从1次涂布变更为2次涂布，2次涂布的叠加效果使相邻液滴间扩散时间更久，液滴间距更小，膜厚更均匀，使"线Mura"不良率从15%降为1%。再次，通过改变PI液滴在过孔周围走线的扩散方向来提高扩散均匀性，通过将喷墨打印机台角度从0°变为2°，进一步使"线Mura"不良率从1%降为0.2%。

Abstract

To improve the production capacity

the polyimide (PI) film coating method of High Advanced Dimension Switch (HADS) products is changed from APR transfer printing (Roller Coater) to inkjet printing(Inkjet Printer). The change of the coating method caused PI droplets can not to fill into the PVX (passivation SiN

)

via

hole because of its high thickness

and the PI solution accumulated around the PVX

via

hole caused "line Mura" issue. By changing product design and process parameter adjustments and process optimization

we try to reduce or eliminate defective products ratio

so that yields could meet the demand for mass production. Firstly

we change the PVX mask to make a shift between PVX

via

hole and Com electrode (half

via

hole on metal). The design of half

via

hole helps PI solution to enter PVX

via

hole. In order to reduce the adverse effect of PVX

via

size and number on PI solution diffusion

the PVX via hole period is changed from 1/3 to 1/6

and the

via

hole size is changed from 5.7 μm to 7.5 μm. The design of the PVX mask has greatly improved the entry of PI solution into

via

hole

which reduces the failure rate from 100% to 15%. Secondly

to improve the uniformity of PI thickness

we change the coating frequency of inkjet printer from 1 time to 2 times

which improves the diffusion time between adjacent droplets

then the droplets spacing is smaller and the film thickness has higher uniformity

its failure rate reduces from 15% to 1%. Thirdly

we improve the diffusion uniformity by changing the diffusion direction of PI solution

and by changing the coating direction of inkjet printer from 0° to 2°

the failure rate is reduced from 1% to 0.2%.

关键词

Keywords

references

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Department of Electronic Engineering, Tianjin University of Technology and Education, Tianjin 300222, China,E-mail:wgw1631@163.com

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Effect of panel via hole design on diffusion of polyimide solution

DOI：10.3788/YJYXS20203504.0321

摘要

Abstract

关键词

Keywords

references