Influence of IC bonding on touch abnormal of TDDI structure

Lei ZHU; Zhong-jun WANG; Shi-qiang HUANG; Pan-pan LI; Wei HU; Hui-zhe LIN

doi:10.3788/YJYXS20193408.0764

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Influence of IC bonding on touch abnormal of TDDI structure

Materials and Devices | 更新时间：2020-12-14

- Influence of IC bonding on touch abnormal of TDDI structure
- Chinese Journal of Liquid Crystals and Displays Vol. 34, Issue 8, Pages: 764-771(2019)
- 作者机构：
  
  重庆京东方光电科技有限公司, 重庆 400700
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20193408.0764
  CLC： TN141.9
- Received：11 March 2019，
  
  Accepted：19 April 2019，
  
  Published：05 August 2019
- 稿件说明：
移动端阅览
Lei ZHU, Zhong-jun WANG, Shi-qiang HUANG, et al. Influence of IC bonding on touch abnormal of TDDI structure[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 764-771.
DOI：

Lei ZHU, Zhong-jun WANG, Shi-qiang HUANG, et al. Influence of IC bonding on touch abnormal of TDDI structure[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 764-771. DOI： 10.3788/YJYXS20193408.0764.

摘要

为了减少触摸屏生产过程中以及客户端触控不良的发生，提高良率，本文研究了IC绑定对触控与显示驱动器集成（Touch and Display Driver Integration，TDDI）结构触控不良的影响。首先，利用新思IC厂商开发的容值测试软件进行测试，根据测试结果确认触控不良的种类；其次进行IC交叉验证，根据测试结果确认显示屏还是IC存在问题。研究结果表明，各向异性导电膜（Anisotropic Conductive Film，ACF）胶厚度较厚造成了IC绑定粒子变形小，接触面积较小，导致了较大的接触电阻，出现触控不良。通过更换厚度较薄的ACF胶，不良得到改善，模组厂不良发生率从3.935×10

-3

降低至8.38×10

-4

，客户端不良率从1.5×10

-3

降低至0。通过变更ACF胶厚度，改善IC绑定粒子状态，可以有效减少触控不良的发生。

Abstract

In order to reduce the occurrence of touch abnormal in the production process and client-side

improve the yield

the influence of IC bonding on touch abnormal of TDDI(Touch and Display Driver Integration) structure was studied in this paper. Firstly

Synaptics IC manufacturer's capacitance testing results was used to identify the types of touch abnormal. Then

which had problems

the panel or IC was to be confirmed according to the IC cross validation results. The results show that the IC bonding particles have small deformation and contact area due to the ACF thickness

and it causes greater contact resistance and touch abnormal. The defect ratio is improved by replacing a thinner ACF

and it is decreased from 3.935×10

-3

to 8.38×10

-4

in module factory and decreased from 1.5×10

-3

to 0 in customer. Improving the state of IC binding particles can effectively reduce the occurrence of TP fail by changing the thickness of ACF.

关键词

Keywords

references

孙红彪, 段青鹏, 赵乃辉.从全贴合技术发展分析触控面板市场发展趋势[J].电子工业专用设备, 2013(6):45-49.

SUN H B, DUAN Q P, ZHAO N H. Analysis of the touch panel market trends from the full-fit technology development[J]. Equipment for Electronic Products Manufacturing , 2013(6):45-49. (in Chinese)

MA J, YAO Q J, LU F, et al . Panel structure evolution of in-cell capacitive touch sensor[J]. SID Symposium Digest of Technical Papers , 2015, 46(1):1004-1007.

王永贵, 何连连.内嵌式电容触摸屏技术介绍[J].电视技术, 2015, 39(S1):236-238, 241.

WANG Y G, HE L L. Introduction of technology of integrated capacitive touch screen[J]. Video Engineering , 2015, 39(S1):236-238, 241. (in Chinese)

YANG I S, KWON O K. A touch controller using differential sensing method for on-cell capacitive touch screen panel systems[J]. IEEE Transactions on Consumer Electronics , 2011, 57(3):1027-1032.

汤华娟, 王承遇. OGS用高强度面板玻璃成分[J].玻璃与搪瓷, 2013, 41(6):31-33, 41.

TANG H J, WANG C Y. Glass composition for high strength OGS panel[J]. Glass & Enamel , 2013, 41(6):31-33, 41. (in Chinese)

王鸣昕, 周刘飞, 田汝强.基于IGZO的5.5 in FHD In-cell触控FFS面板设计[J].液晶与显示, 2017, 32(12):943-948.

WANG M X, ZHOU L F, TIAN R Q. Design of 5.5 in IGZO TFT FFS in-cell touch panel[J]. Chinese Journal of Liquid Crystals and Displays , 2017, 32(12):943-948. (in Chinese)

占小奇, 钱志禹, 李艳平, 等. Ag对TDDI结构电容值的影响研究[J].电子世界, 2017(22):105-107.

ZHAN X Q, QIAN Z Y, LI Y P, et al . Influence of Ag on capacitance with TDDI structure[J]. Electronics World , 2017(22):105-107. (in Chinese)

王艳艳, 何为, 王守绪, 等.平板显示器中应用ACF的驱动IC封装技术[J].印制电路信息, 2010(8):60-62.

WANG Y Y, HE W, WANG S X, et al . Driver IC packaging technologies using anisotropic conductive films in flat panel display[J]. Printed Circuit Information , 2010(8):60-62. (in Chinese)

刘萍. ACF在LCD中的应用与发展[J].电子工艺技术, 2002, 23(6):236-238, 262.

LIU P. The application and development of anisotropic conductive film in liquid crystal display[J]. Electronics Process Technology , 2002, 23(6):236-238, 262.

YEN Y W, LEE C Y. ACF particle distribution in COG process[J]. Microelectronics Reliability , 2011, 51(3):676-684.

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