Reduction and mechanism of particles on mobile products

De-bo YANG; Ye ZHONG; Fang BI; Ming-Lei FAN; Zhi-Chong ZHANG; Qi XIONG; Chun LUO; Wei LI

doi:10.3788/YJYXS20193408.0748

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Reduction and mechanism of particles on mobile products

Materials and Devices | 更新时间：2020-12-14

- Reduction and mechanism of particles on mobile products
- Chinese Journal of Liquid Crystals and Displays Vol. 34, Issue 8, Pages: 748-754(2019)
- 作者机构：
  
  重庆京东方光电科技有限公司, 重庆 400714
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20193408.0748
  CLC： TN141.9
- Received：27 March 2019，
  
  Accepted：16 May 2019，
  
  Published：05 August 2019
- 稿件说明：
移动端阅览
De-bo YANG, Ye ZHONG, Fang BI, et al. Reduction and mechanism of particles on mobile products[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 748-754.
DOI：

De-bo YANG, Ye ZHONG, Fang BI, et al. Reduction and mechanism of particles on mobile products[J]. Chinese journal of liquid crystals and displays, 2019, 34(8): 748-754. DOI： 10.3788/YJYXS20193408.0748.

摘要

异物是TFT-LCD制程常见的顽固缺陷，在高世代线（8.5代线）以摩擦工艺生产mobile产品时不良发生率更高。本文针对8.5代线生产Mobile产品时所产生的异物进行原因及机理分析，发现该异物来源于摩擦制程，产生机理为：摩擦辊在玻璃基板上摩擦时，布毛容易刮起配向膜而产生细小的PI碎屑。为此本文从摩擦强度、单辊摩擦和光配向工艺进行实验，实验结果显示：对于改善细小的PI碎屑最优工艺为光配向，异物不良由2.34%降至0.41%。在最优的光配向工艺条件下继续优化清洗机条件：在高压气液混合喷射（HPMJ）的压力8 MPa、清洗机速度6 600 mm/min和风刀喷淋（AK Shower）打开条件下异物不良降至0.16%，改善效果明显。

Abstract

In the manufacturing process of TFT-LCD

Particles are commonly-encountered defects

which results in a high reject ratio when producing mobile products by rubbing technology in higher-generation production line (8.5 generation line). Focusing on the Particles arising from producing mobile dvices in 8.5 generation line

we analyzed its cause and mechanism. The analysis shows that the Particles originate from rubbing procedure. The mechanism suggests that as the rubbing roller rubs the glass substrate

the cloth is prone to scrapes alignment film to give rise to fine PI fragments. This paper carried out investigation of the rubbing strength

single roller friction and optical alignment technology. The results show that among the three methods mentioned

the optical alignment is the most efficient way to reduce the PI fragments

cutting the reject ratio down to 0.41% from 2.34%. Further

ARC(After rubbing cleaner) condition optimized under the light best alignment technology is obtained:8 MPa of HPMJ(High pressure micro jet)

speed of ARC at 6 600 mm/min and the opened AK(Air knife) Shower

which evidently lowers the reject ratio to 0.16%.

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Keywords

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