Mechanism and design improvement on Rubbing Mura

Rong-rong GAO; Jun-hao LIU; Bao-quan ZHOU; Jian-cheng WANG; Zhou-sheng ZHANG; Ai-cui ZUO; Wei-cheng CHEN

doi:10.3788/YJYXS20193406.0570

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Mechanism and design improvement on Rubbing Mura

Materials and Devices | 更新时间：2020-07-05

- Mechanism and design improvement on Rubbing Mura
- Chinese Journal of Liquid Crystals and Displays Vol. 34, Issue 6, Pages: 570-575(2019)
- 作者机构：
  
  合肥京东方光电科技有限公司 Cell分厂, 安徽合肥 230012
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20193406.0570
  CLC： TN141.9
- Received：27 December 2018，
  
  Accepted：15 April 2019，
  
  Published：05 June 2019
- 稿件说明：
移动端阅览
Rong-rong GAO, Jun-hao LIU, Bao-quan ZHOU, et al. Mechanism and design improvement on Rubbing Mura[J]. Chinese journal of liquid crystals and displays, 2019, 34(6): 570-575.
DOI：

Rong-rong GAO, Jun-hao LIU, Bao-quan ZHOU, et al. Mechanism and design improvement on Rubbing Mura[J]. Chinese journal of liquid crystals and displays, 2019, 34(6): 570-575. DOI： 10.3788/YJYXS20193406.0570.

摘要

摩擦Mura是ADS型TFT-LCD中一种常见不良，本文主要对摩擦过程中固定位置的Mura进行理论研究和实验测试。摩擦Mura产生原因是TFT基板上的源极线附近的摩擦弱区漏光。从产品设计方面找出影响这种固定位置的摩擦Mura的主要因子为ITO材质、段差、过孔密度。ITO材质为金属材质，摩擦时对摩擦布损伤较大，摩擦方向上ITO越长对摩擦布损伤越大，摩擦Mura越明显。设计时需要尽力保证摩擦方向上ITO长度一致。段差会导致摩擦布经过高低不同区域时产生损伤，设计时需要尽力保证摩擦方向上段差一致。过孔是密度影响，孔径直径（5

m）

摩擦布毛直径（11

m），密度越小则摩擦Mura越轻。以15.0FHD产品为例，对周边电路设计位置ITO材质/源极线/过孔密度等膜层进行设计优化，摩擦Mura发生率从5%降至0%，改善效果明显。

Abstract

Rubbing Mura is a common defect in ADS mode TFT-LCD product. This paper mainly studies the fixed position Mura in rubbing process. It is found that Rubbing Mara is caused by the leakage of light from the weak zone of the source data (SD)

and the main design factors are ITO material

height difference and

via

-hole density. ITO material is metal

the longer of the ITO length in rubbing direction is

the greater the damage to the rubbing cloth is

and more obvious the rubbing Mura is. The ITO length design should be ensured as much as possible. The cloth is damaged when the rubbing cloth travels through different height. The height design should be same as much as possible. The

via

-hole density is important

the

via

-hole diameter (5

m) is less than the cloth pin diameter (11

and the thinner the

via

- hole

the better the Mura is. Take 15.0FHD product as an example. By optimzing Pad about data

Gate

ITO and other films

the Rubbing Mura reduced from 5% to 0%

the effect of improvement is obvious.

关键词

Keywords

references

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