Photoresist and film adhesive force in LTPS process

Yong-bo JU; Jian-jun CHEN; Chen-ming ZHANG; Yue-yuan JIAN; Zheng-ping XIONG; Long-quan ZHANG; Dong-sheng ZHAO; Shao-xian LUO; Hao LIU; Hong-wei SUN; He-peng BAI

doi:10.3788/YJYXS20173203.0190

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Photoresist and film adhesive force in LTPS process

Material and Device | 更新时间：2020-07-07

- Photoresist and film adhesive force in LTPS process
- Chinese Journal of Liquid Crystals and Displays Vol. 32, Issue 3, Pages: 190-195(2017)
- 作者机构：
  
  1.鄂尔多斯市源盛光电有限责任公司, 内蒙古鄂尔多斯 017000
  2.京东方科技集团股份有限责任公司, 北京 100176
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20173203.0190
  CLC： TP394.1;TH691.9
- Received：22 September 2016，
  
  Accepted：11 October 2016，
  
  Published：2017-03
- 稿件说明：
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Yong-bo JU, Jian-jun CHEN, Chen-ming ZHANG, et al. Photoresist and film adhesive force in LTPS process[J]. Chinese journal of liquid crystals and displays, 2017, 32(3): 190-195.
DOI：

Yong-bo JU, Jian-jun CHEN, Chen-ming ZHANG, et al. Photoresist and film adhesive force in LTPS process[J]. Chinese journal of liquid crystals and displays, 2017, 32(3): 190-195. DOI： 10.3788/YJYXS20173203.0190.

摘要

本文对影响LTPS工艺中光刻胶和衬底间粘附力的4个因素进行了实验及理论分析。经实验发现：衬底的材质和粗糙度以及光刻胶中分子量的分布是影响光刻胶和衬底粘附力的最重要的两个因素。在改善粘附力方面HMDS对于电负性较强的金属衬底和光刻胶的粘附力有较好的改善效果，对于SiN

、A-Si及P-Si衬底改善效果明显，且无差异，对于ITO没有改善。光刻胶涂布后适当延长烘烤时间也可以有效改善光刻胶和衬底的粘附力。

Abstract

In this paper

four factors have been experimented and analyzed theoretically

which will influence the adhesion between photoresist and the substrate in LTPS process. It is found that the substrate material and roughness and the molecular weight distribution in the photoresist are the two most important factors that affect the adhesion between photoresist and the substrate. In terms of improving adhesion

HMDS makes better performance in improving the adhesion between strong electronegativity metal substrate and photoresist

while has obvious improvement effect in SiN

A-Si and P-Si substrate

and without any difference among them. But there is no improvement in ITO. Properly extending the baking time can also effectively improve the adhesion between photoresist and the substrate after the photoresist has been coated.

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Keywords

references

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