Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity

FAN Xue-li; JING Rui-kuan; WENG Chao; CHEN Qi-xing; WANG Yan-ming; XIAO Hong-xi; LIU Huan-

doi:10.3788/YJYXS20163101.0067

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Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity

Material and Device | 更新时间：2020-08-12

- Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity
- Chinese Journal of Liquid Crystals and Displays Vol. 31, Issue 1, Pages: 67-73(2016)
- 作者机构：
  
  北京京东方光电科技有限公司北京,100176
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20163101.0067
  CLC：
- Received：05 June 2015，
  
  Revised：22 July 2015，
  
  Published：05 January 2016
- 稿件说明：
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范学丽, 靖瑞宽, 翁超等. 湿法刻蚀FI CD均一性的影响因素及提高刻蚀均一性的研究[J]. 液晶与显示, 2016,31(1): 67-73

FAN Xue-li, JING Rui-kuan, WENG Chao etc. Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity[J]. , 2016,31(1): 67-73
范学丽, 靖瑞宽, 翁超等. 湿法刻蚀FI CD均一性的影响因素及提高刻蚀均一性的研究[J]. 液晶与显示, 2016,31(1): 67-73 DOI： 10.3788/YJYXS20163101.0067.

FAN Xue-li, JING Rui-kuan, WENG Chao etc. Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity[J]. , 2016,31(1): 67-73 DOI： 10.3788/YJYXS20163101.0067.

摘要

随着高分辨率产品导入

TFT-LCD阵列段各项参数范围越来越小

工艺要求更为严格

为了更好地管控湿法刻蚀各项参数

本文以湿法刻蚀FI CD(Final Inspection Critical Dimension)均一性的影响因素及如何提高FI CD均一性为目的进行研究。首先

通过对湿法刻蚀设备参数(主要包括刻蚀液温度、流量、压力、浓度、Nozzle Sliding、Oscillation Speed、刻蚀时间等)进行试验

验证各项参数对FI CD均一性的影响。其次

对沉积工序、曝光工序以及产品设计等进行试验

获悉影响因素并进行改善。通过对湿法刻蚀设备自身参数的调整

如减少设备温度、流量、压力波动

使参数保持相对稳定状态

可有效改善湿法刻蚀FI CD均一性

FI CD的均一性可从1.0降低至0.5。通过对湿法刻蚀设备参数进行试验并做相应调整

湿法刻蚀FI CD均一性改善效果显著。

Abstract

With the gradual introduction of high resolution products

the process parameter margin of TFT-LCD array is getting stricter. In order to control the wet etching parameters better

the influence factors of wet etching FI CD uniformity and how to improve the uniformity of wet etching are studied. Firstly

we study and testify the influence of parameters of wet etching equipment on uniformity

including the etching temperature

flowrate

pressure

concentration

Nozzle Sliding

Oscillation Speed

etching time

etc. Secondly

we study how the deposition process

exposure procedure and product design may affect the uniformity and try to improve them. Research result shows that a stable parameter can significantly help the etch uniformity. By stabilizing the parameters of temperature

flowrate and pressure

the uniformity of FICD has decrease from 1.0 to 0.5. Testing and adjusting the parameters of wet etching equipment accordingly can effectively improve the etching uniformity and improve the effect significantly.

关键词

Keywords

references

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