Failure analysis for chip resistor of TDICCD camera imaging system

QU Li-xin

doi:10.3788/YJYXS20142906.0906

您当前的位置：

首页 >

文章列表页 >

Failure analysis for chip resistor of TDICCD camera imaging system

Table of contents | 更新时间：2020-08-12

- Failure analysis for chip resistor of TDICCD camera imaging system
- Chinese Journal of Liquid Crystals and Displays Vol. 29, Issue 6, Pages: 906-910(2014)
- 作者机构：
  
  中国科学院长春光学精密机械与物理研究所, 吉林长春 130033
- 作者简介：
- 基金信息：
- DOI：10.3788/YJYXS20142906.0906
  CLC： TV19
- Received：06 January 2014，
  
  Revised：11 February 2014，
  
  Published Online：02 May 2014，
  
  Published：05 December 2014
- 稿件说明：
移动端阅览
曲利新. TDICCD相机成像系统片式电阻失效分析[J]. 液晶与显示, 2014,29(6): 906-910

QU Li-xin. Failure analysis for chip resistor of TDICCD camera imaging system[J]. , 2014,29(6): 906-910
曲利新. TDICCD相机成像系统片式电阻失效分析[J]. 液晶与显示, 2014,29(6): 906-910 DOI： 10.3788/YJYXS20142906.0906.

QU Li-xin. Failure analysis for chip resistor of TDICCD camera imaging system[J]. , 2014,29(6): 906-910 DOI： 10.3788/YJYXS20142906.0906.

摘要

为了判断TDICCD相机成像系统在温度循环试验中出现的故障原因，通过故障模式影响及危害性分析，建立了故障树。经排查分析和测试，判断故障部位是地址线表面贴装片式电阻。元器件可靠性中心通过电测和DPA，对该片式电阻进行了失效分析。检查结果表明，该片式电阻是由使用过程中的异常外力造成片式电阻器端电极局部脱落，并排除了该器件存在批次性缺陷的可能。异常外力的来源是电装操作人员在返修过程中焊接时间过长，热应力导致片式电阻器端电极局部脱落。改进措施为严格控制片式电阻焊接时间小于2 s。该故障定位准确，机理清楚，经试验验证，措施有效。

Abstract

In order to determine the fault reason of TDI CCD camera imaging system during temperature cycle experimentation

the failure tree is established through fault mode effect and harm analysis. Through detail checking and testing

the fault is located in the region where the surface mount resistor is mounted for address. The failure analysis of this chip resistor is done in the components reliability center through electric test and DPA. Checking results show that exceptional stress causes terminal break off of the resistor during operation. The lot default probability is also precluded. The exceptional stress is derived from long time soldering during the repair by the soldering people. This thermal stress causes the terminal break off of the resistor. The fault is located correctly. The improved measure is limiting the soldering time of chip resistors strictly no more than 2 s. The principle is also clear. The solution is effective after experimental validation.

关键词

Keywords

references

GJB4027A-2006 军用电子元器件破坏性物理分析方法[S]. GJB4027A-2006 Methods of Destructive Physical Analysis for Military Electronic Components[S].(in Chinese)[2] GJB 1032-1990 电子产品环境应力筛选方法[S]. GJB 1032-1990 Environmental Stress Screening Process for Electronic Products[S].(in Chinese)[3] 夏虹,郑鹏洲.电子元器件失效分析及应用[M].北京:国防工业出版社,1998. Xia H,Zheng P Z.Failure Analysis and Application for Electronic Components[M].Beijing:National Defence Industry Press,1998.(in Chinese)[4] 黄娇英. 军用电磁继电器失效分析研究[J]. 现代电子技术, 2013, 36(10):131-135. Huang J Y. Failure analysis of electromagnetic relay used in military engineeing[J].Modern Electronics Technique,2013,36(10):131-135.(in Chinese)[5] 刘银铃. 环境应力筛选试验故障排除方案探讨[J]. 电子产品可靠性与环境试验, 2012,30(8):6-8. Liu Y L.Troubleshooting solution in environmental stress screening[J].Electronic Product Reliability and Environmental Testing,2012,30(8):6-8.(in Chinese)[6] 李兴鸿. 集成电路开短路失效原因探讨[J]. 电子产品可靠性与环境试验, 2012,30(12):20-22. Li X H. Failure cause research on IC open and short circuit[J].Electronic Product Reliability and Environmental Testing,2012,30(12):20-22.(in Chinese)[7] 范红梅. 宇航元器件热环境适应性评价技术研究[J]. 电子产品可靠性与环境试验, 2012,30(6):6-10. Fan H M.Evaluation of thermal environmental adaptability of space-borne components[J].Electronic Product Reliability and Environmental Testing,2012,30(6):6-10.(in Chinese)[8] 周海京,遇今. 故障模式、影响及危害性分析与故障树分析[M].北京:航空工业出版社,2003. Zhou H J,Yu J.Failure Mode Effects and Criticality Analysis and Failure Tree Analysis[M].Beijing:Aviation Industry Press,2003.(in Chinese)[9] GJB/Z 1391-2006故障模式、影响及危害性分析指南[S]. GJB/Z 1391-2006 Failure mode effects and criticality analysis guide.[S].(in Chinese)[10] 盛念. 军用塑封器件失效机理研究和试验流程[J]. 电子产品可靠性与环境试验, 2012,30(4):6-10. Sheng N. Failure mechanism research and test procedure for military plastic encapsulated microcircuit[J].Electronic Product Reliability and Environmental Testing,2012,30(4):6-10.(in Chinese)[11] 薛旭成,石俊霞,吕恒毅,等. 空间遥感相机TDICCD积分级数和增益的优化设置[J]. 光学精密工程, 2011,19(4):857-863. Xue X C,Shi J X,Lv H Y,et al.Optimal set of TDICCD integration stages and gains of space remote sensing cameras[J].Opt.Precision Eng.,2011,19(4):857-863.(in Chinese)[12] 薛旭成,傅瑶,韩诚山. TDICCD相机的卫星姿态稳定度确定[J]. 中国光学, 2013,6(5):767-771. Xue X C,Fu Y,Han C S. Confirmation of satellite attitude stabilization for TDICCD camera[J].Chinese Optics,2013,6(5):767-771.(in Chinese)

Views

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

N & K Analyzer in OLED Failure Analysis

Related Author

CHEN Liu

YU Hong-kun

ZENG Wei

PENG Ya-fang

Related Institution

Department of Materials Science, Fudan University

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China 130033 Postal code：130033
Tel：0431-86176059 Email：yjxs@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰