The relationship between LCD construction and Electrostatic Discharge(ESD) path was studied. Driver IC with the 2 kV ability for ESD generally

is the most easily damaged device when LCD attacked by ESD and the ESD charge is unable to disperse. LCD module can't work properly when drive IC was damaged. It is proved that additional device for ESD protect on the path of ESD circuit can conduct instantaneous current to ground to improve the ESD resistant ability of LCD module. A new method for additional electrostatic ring design on TFT substrate can instead of adding TVS tubes on FPC circuit

and this new design can be implemented without cost up.