PU Dong-lin, HU Jin, ZHU Peng-fei, WEI Guo-jun, CHEN Lin-sen. Design and Fabrication of Metal Microcup Mould for E-Paper[J]. , 2011,26(2): 174-177 DOI: 10.3788/YJYXS20112602.0174.
Design and Fabrication of Metal Microcup Mould for E-Paper
A 'selective grow method for fabricating E-paper metal mould was approached. The microcup pattern with insulating material was made on metal substrate and the mould was obtained with follow-up process. First
Negative photo resists was coated on the metal substrate and the microcup pattern was exposed by a SLM LDW system. Second
after developing process
the metal mould was made by electroforming. The experiment results are according to the input parameters. This method is suit for larger format process
it will be an effective method for microcup mould.
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references
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Research progress of flexible thin film transistors for E-paper
Innovation Trends of Printed Electronic Paper Technology from a Perspective of Patent Analysis
Related Author
Jun-biao PENG
Hong-long NING
Tai-jiang LIU
Xiao FU
Yue-xin YANG
Jin-yao ZHONG
Xiao-qin WEI
Ri-hui YAO
Related Institution
State Key Laboratory of Luminescent Materials and Devices, School of Materials Science and Engineering, South China University of Technology
Southwest Institute of Technology and Engineering
Institute of Scientific and Technical Information of China
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology