High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging

Yu-ming YANG; Yan LI; Huai-wen ZHENG; Fei YU; Hua YANG; Xiao-yan YI; Jun-xi WANG; Jin-min LI

doi:10.37188/YJYXS20203510.0991

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High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging

Material Physics | 更新时间：2020-09-28

- High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging
- Chinese Journal of Liquid Crystals and Displays Vol. 35, Issue 10, Pages: 991-999(2020)
- 作者机构：
  
  1.中国科学院半导体研究所半导体照明研发中心, 北京 100083
  2.中国科学院大学材料科学与光电技术学院, 北京 100049
- 作者简介：
- 基金信息：
  
  National Key R&D Plan of China(2017YFB0403801)
- DOI：10.37188/YJYXS20203510.0991
  CLC： TN312.8
- Received：31 March 2020，
  
  Revised：08 April 2020，
  
  Accepted：08 April 2020，
  
  Published：05 October 2020
- 稿件说明：
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Yu-ming YANG, Yan LI, Huai-wen ZHENG, et al. High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging[J]. Chinese journal of liquid crystals and displays, 2020, 35(10): 991-999.
DOI：

Yu-ming YANG, Yan LI, Huai-wen ZHENG, et al. High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging[J]. Chinese journal of liquid crystals and displays, 2020, 35(10): 991-999. DOI： 10.37188/YJYXS20203510.0991.

摘要

传统的直接镀铜(DPC)陶瓷基板的焊盘上镀有Ni/Au金属覆盖层，它会强烈吸收紫外(UV)光。为了提高深紫外发光二极管(DUV LED)的光提取效率(LEE)，设计并制备了镀Al的双层金属镀层DPC陶瓷基板。这种基板拥有一层完全覆盖基板焊盘的Ni/Au镀层为LED提供电互连，以及一层部分覆盖Ni/Au镀层的高反射Al镀层为UV光提供优异的反射。测量了分别由镀Al的DPC陶瓷基板和仅有一层Ni/Au镀层的传统DPC陶瓷基板所封装的DUV LED的光学、电学和热学性质，并建立了LED封装体的模型并进行了分析。结果表明，通过使用镀Al的DPC陶瓷基板，DUV LED的光输出功率(LOP)提高了19.2%，功率效率(WPE)和外量子效率(EQE)则分别提高为传统封装的1.20和1.19倍。此外，经过160 h的老化测试，使用镀Al的DPC陶瓷基板封装的LED表现出了更好的可靠性。这种镀Al的双层金属镀层DPC陶瓷基板为通过封装改善DUV LED的LEE提供了可行的方法。

Abstract

Ni/Au coating films plated on traditional direct plated copper (DPC) ceramic substrates will strongly absorb ultraviolet (UV) light. To enhance light extraction efficiency (LEE) of deep ultraviolet light emitting diodes (DUV LEDs)

a DPC ceramic substrate plated with two metal coating films was designed and prepared. A Ni/Au film covering the pad of the DPC ceramic substrate can provide electrical interconnection for LEDs

and a high-reflection Al film partly covering the Ni/Au film can provide superior reflection for UV light. Optical

electrical and thermal properties of the DUV LED packaged by the Al-plated DPC ceramic substrate and traditional DPC ceramic substrate with only one Ni/Au coating film were measured

and models of the packaged LED were established and analyzed. As a result

by using the Al-plated DPC ceramic substrate

the light output power (LOP) of the DUV LED is enhanced by 19.2%

while the wall plug efficiency (WPE) and the external quantum efficiency (EQE) are enhanced by 1.20 and 1.19 times

respectively. Furthermore

after aging tests for 160 h

LEDs packaged by Al-plated DPC ceramic substrates showed better reliability. This Al-plated DPC ceramic substrate provides a feasible way to improve the LEE of DUV LEDs by packaging.

关键词

Keywords

references

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Faculty of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China, E-mail: liuyuan@gdut.edu.

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