Influence of temperature and cell gap on the characteristics of photo spacer

Xiang HUANG; Hai-bin YIN; Zhi-wei CHENG; Wen-lei XU; Xiong-ying SHI

doi:10.37188/CJLCD.2021-0242

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Influence of temperature and cell gap on the characteristics of photo spacer

Display Technologyand Applications | 更新时间：2021-12-10

- Influence of temperature and cell gap on the characteristics of photo spacer
- Chinese Journal of Liquid Crystals and Displays Vol. 36, Issue 12, Pages: 1658-1663(2021)
- 作者机构：
  
  武汉京东方光电科技有限公司, 湖北武汉
- 作者简介：
- 基金信息：
- DOI：10.37188/CJLCD.2021-0242
  CLC： TP141.9
- Received：17 September 2021，
  
  Revised：18 October 2021，
  
  Published：2021-12
- 稿件说明：
移动端阅览
Xiang HUANG, Hai-bin YIN, Zhi-wei CHENG, et al. Influence of temperature and cell gap on the characteristics of photo spacer[J]. Chinese journal of liquid crystals and displays, 2021, 36(12): 1658-1663.
DOI：

Xiang HUANG, Hai-bin YIN, Zhi-wei CHENG, et al. Influence of temperature and cell gap on the characteristics of photo spacer[J]. Chinese journal of liquid crystals and displays, 2021, 36(12): 1658-1663. DOI： 10.37188/CJLCD.2021-0242.

摘要

为保证在一定工艺波动范围内显示的稳定性，新品开发时通常会评价显示屏液晶安全范围（LC Margin）。其中，柱状隔垫物（PS）特性对LC Margin的影响尤为显著，因此本文针对PS特性的影响因素进行了相关研究。分析了环境温度与PS材料杨氏模量的关系，探究了PS杨氏模量随温度的变化规律，研究了工艺制程温度对PS弹性回复率的影响。最后，探究了相同PS规格的显示屏在不同盒厚下的弹性回复速率。实验结果表明：环境温度升高时，PS材料的杨氏模量随之降低；而当工艺制程温度升高时，PS的弹性回复率会略微增加，且PS的弹性回复速率会随着盒厚升高而变快。

Abstract

To ensure display stability of LCD in a certain process fluctuating range

LC Margin is usually estimated for new products developing. Especially

the property of photo spacer (PS) mattered significantly for LC Margin. This work focuses on influence factors of PS characters. First of all

the relationship between ambient temperature and PS Young's modulus is analyzed to detect their variety trend. Then

the influence of process temperature on PS elastic recovery ratio(PS ER) is studied. Finally

the elastic recovery rate of PS with same specific characters at different cell gap is discnssed. Related experiment results indicates that PS Young's modulus decreases with the increasing of ambient temperature

and the PS ER increases slightly with the in creasing of process temperature. On the other hand

the PS in higher cell gap recovers a little more quickly refer to lower cell gap.

关键词

Keywords

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