Analysis of metal layer in flexible screen on COF bending

Hong-bing ZHENG; Yang WANG; Ning WANG; Hon-jun YIN; Zeng-chao GONG; Zhao LIANG; Mu ZENG; Xian HAO; Qiang HAN

doi:10.37188/CJLCD.2021-0077

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Analysis of metal layer in flexible screen on COF bending

Display Technology and Applications | 更新时间：2021-08-05

- Analysis of metal layer in flexible screen on COF bending
- Chinese Journal of Liquid Crystals and Displays Vol. 36, Issue 8, Pages: 1121-1127(2021)
- 作者机构：
  
  绵阳京东方光电科技有限公司, 四川绵阳 621000
- 作者简介：
- 基金信息：
- DOI：10.37188/CJLCD.2021-0077
  CLC： TN383.1;TH691.9
- Received：26 March 2021，
  
  Revised：19 April 2021，
  
  Published：2021-08
- 稿件说明：
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Hong-bing ZHENG, Yang WANG, Ning WANG, et al. Analysis of metal layer in flexible screen on COF bending[J]. Chinese journal of liquid crystals and displays, 2021, 36(8): 1121-1127.
DOI：

Hong-bing ZHENG, Yang WANG, Ning WANG, et al. Analysis of metal layer in flexible screen on COF bending[J]. Chinese journal of liquid crystals and displays, 2021, 36(8): 1121-1127. DOI： 10.37188/CJLCD.2021-0077.

摘要

OLED屏幕COF连接过渡区在弯折和可靠性阶段易发生金属层断裂的问题。本文给出了柔性屏COF区的弯折路径，通过有限元方法，分析了COF连接过渡区相关结构的偏移、胶层厚度在弯折过程和可靠性因素下对金属层应力的影响，同时研究了弯折路径改变后金属层应力的变化情况。结果表明：金属层在弯折过程中受到的最大应力幅值分别随U型膜向左、向右偏移和弯折路径向上、向下移动而明显增大，也随泡棉从左往右偏移和金属包覆层厚度增加而逐渐变大；可靠性结果中金属层受到的最大应力分别随U型膜和泡棉从左往右偏移先减小后趋于稳定，也随金属包覆层在初始厚度的基础上增加先增大后减小。分析结果为弯折区相关堆叠结构设计和其贴附偏差区间管控提供了参考依据，为弯折路径设计和排故分析提供了理论依据。

Abstract

The OLED screen COF (Chip on Film) connection transition zone is prone to the problem of metal layer fracture in the bending and reliability stages. In this paper

the COF bending traveled of flexible screen is showed. And the finite element method is used to analyze the influence of those factor

such as the offset of related structure in the transition zone of COF connection

the thickness of the adhesive layer on the stress of the metal layer under the bending process and the reliability factors. Meanwhile

the change of metal layer stress is researched after bending path altered. The results show that the maximum stress amplitude of metal layer in bending process increases obviously with U-film shifting to the left and right

bending path moving up and down

and also increases gradually with Foam shifting from left to right and the thickness of the metal cover layer (MCL) glue increasing. In the reliability results

the maximum stress on the metal layer is decreased then stable with the deviation of U-film and Foam from left to right

and is increased and then decreased with the increase of the MCL thickness added. The analysis results provide a reference for the design of the stacking structure and the control of its attached deviation interval in the bending zone. Meantime

it provide a theoretical basis for the design of the bending path and troubleshooting analysis.

关键词

Keywords

references

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