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1.重庆京东方光电科技有限公司, 重庆 400700
2.重庆大学 物理学院, 重庆 400044
3.中国科学院大学 重庆学院, 重庆 400714
Received:03 September 2020,
Revised:25 November 2020,
Published:2021-04
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Dan LIU, Yi LIU, Zhong-hao HUANG, et al. Trend and influence of ITO etchant concentration under mass production conditions[J]. Chinese journal of liquid crystals and displays, 2021, 36(4): 549-559.
Dan LIU, Yi LIU, Zhong-hao HUANG, et al. Trend and influence of ITO etchant concentration under mass production conditions[J]. Chinese journal of liquid crystals and displays, 2021, 36(4): 549-559. DOI: 10.37188/CJLCD.2020-0223.
ITO刻蚀产线由刻蚀设备、中央药液供给系统(Chemical central Supply System,CCSS)、刻蚀液管理系统(Etchant Management System,EMS)3大组件构成。明确组件之间的相互作用,确认相互作用对刻蚀液浓度的影响,进而管控刻蚀,对ITO刻蚀制程至关重要。本文结合重庆京东方ITO刻蚀产线,探究不同生产模式下刻蚀液各组分浓度的变化,结合回归分析、因果链和统计方法分析了各成分浓度变化的原因,并确认刻蚀液浓度变化对刻蚀程度的影响。实验结果表明:仅CCSS开启,刻蚀液中酸液浓度增加,致其刻蚀能力逐渐增强。在CCSS开启的基础上,EMS开启补充水和硝酸功能,可以保持刻蚀液浓度稳定,进而延长刻蚀液的使用时间。但是,在CCSS和EMS补给均开启的模式下,刻蚀液浓度在初期波动,然后逐步趋于稳定,且在浓度波动期间会有一个硝酸浓度偏高的区域,此区域的刻蚀能力强。该研究为ITO刻蚀液使用时间延长、产品良率提升提供了参考。
The ITO etching production line consists of three components: etching equipment
central chemical supply system (CCSS)
and etchant management system (EMS). It is necessary to clarify the influence of components interaction on etchant concentration
which is important to ITO etching process. In this article
the changes in the concentration of each ingredient of etchant is explored under different production modes
based on ITO etching production line of Chongqing BOE. In addition
regression analysis
cause-effect analysis and statistical methods are used to analyze the reasons for the changes in the concentration of etchant
and the influence of etchant concentration on etching degree is confirmed. The results show that when only CCSS is turned on
the acid concentration of etchant increases
causing etching ability to gradually increase. Under the premise that the CCSS supply is turned on
and the EMS is enabled for the water and HNO
3
replenishment function
the concentration of etchant can keep stable by adjusting the replenishment rate of HNO
3
and water
thereby the use time of the etchant can be extended. However
in the mode where both CCSS and EMS replenishment are turned on
the etchant concentration fluctuates in the initial stage
and then gradually stabilizes. And during the period of concentration fluctuation
there will be a stage with a high concentration of HNO
3
which has strong etching ability. This research provides a reference for extending the use time of ITO etchant and improving the product yield under mass production conditions.
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