There are hundreds of defects happening during TFT-LCD process

especially during array process. Eroded array metal line is one of defects that can cause bright line or thin bright line defect. In this paper

this typical defect was analyzed by SEM

FIB

EDS and statistical software such as BO (Business Objects) and CIM (Computer Integrated Manufacturing). The results show that the defect occurred mainly when the metal layer was eroded by hydrochloric acid gas between Gate Etch process and Multi-Deposition process

and the leakage source of acid gas was identified. The hump in defect position was formed when vacuumizing during Multi-Deposition process. In addition

the emergency measures for this defect were also discussed.