Lamps based on multi-LED combined have being used more and more widely. Such lamps can be manufactured not only by packaging multi-LED in one unit
but also by distributing many packaged LED individual lamps on print circuit board(PCB) directly. The two approaches decide the difference in lamp structure
heat transmission capability
maintenance
and so on. The connection methods of LEDs affect directly the current balance between different LED serials. Several different driver designs are discussed in this paper in order to insure the consistency of different LED serials. Furthermore
one kind of heat transmission scheme based on epoxy print circuit board has experimented
which can achieve the same effect as PCB based on aluminium.
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references
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