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天津工程师范大学 电子工程系,天津 300222,E-mail: wgw1631@163.com
Received:17 October 2008,
Revised:02 January 1900,
Published Online:30 June 2009,
Published:30 June 2009
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王光伟;张建民;倪晓昌;李 莉. 非晶硅和非晶硅锗薄膜的金属诱导结晶[J]. 液晶与显示, 2009,24(3): 356-366
WANG Guang-wei;ZHANG Jian-min;NI Xiao-chang;LI Li. Metal-Induced Crystallization of Amorphous Silicon and Silicon Germanium Films[J]. 液晶与显示, 2009,24(3): 356-366
分析了金属Ni、Al诱导非晶Si及非晶SiGe薄膜结晶的条件、特点和机理。简要介绍了金属诱导结晶相对于其它一些结晶工艺的优势及其在薄膜晶体管中的应用。概述了影响诱导结晶速率和薄膜微结构的诸多因素
如热处理条件和外加电场等。对电场增强金属诱导横向结晶的相关问题进行了探讨
指出适当强度的电场可显著加快横向诱导结晶的速率
但更强电场则会降低该速率
基于电迁移效应对该现象进行了解释。
The conditions
specialties and mechanism of amorphous Si and SiGe films crystallization induced by Ni and Al were analyzed systematically. Advantages of metal-induced crystallization over other crystallizing techniques and its application in thin film transistor fabrication were briefly introduced. And some influencing factors on crystallization velocity as well as the microstructure of the films
such as thermal process conditions and external electric field and etc
were recapitulated. Also
problems existing in electric field-aided metal-induced lateral crystallization were discussed. It was demonstrated that there exists a critical electric field strength
below which
the velocity of metal-induced lateral crystallization increases remarkably with the increase of field strength
while above which the velocity will decrease instead. This phenomenon can be interpreted fairly well in terms of electromigration effect.
. Matsumura M, Chang H O. Advanced excimer-laser annealing for quasi single-crystal silicon thin-film devices [J].Thin Solid Films, 1999, 337(1-2):123-128.
. Sawano K, Fukumoto Y, Hoshi Y, et al. Strained Si n-channel metal-oxide-semiconductor field-effect transistors formed on very thin SiGe relaxed layer fabricated by ion implantation technique [J]. Appl. Phys. Lett., 2007, 90(20):202101(1-3).
. Chan V W C,Chan P C H,Chan M, et al. Three-dimensional CMOS SOI integrated circuit using high-temperature metal-induced lateral crystallization [J]. IEEE Trans. Electron Device,2001, 48(7):1394-1399.
. Gall S, Muske M, Sieber I, et al. Aluminum-induced crystallization of amorphous silicon [J]. J. Non-Crystalline Solids, 2002,299-302(part 2):741-745.
. Miyasaka M, Makihira K, Asano T, et al. In situ observation of nickel metal-induced lateral crystallization of amorphous silicon thin films [J]. Appl. Phys. Lett., 2002, 80(6):944-946.
. Pereira L, Aguas H, Martins R M S, et al. Polycrystalline silicon obtained by metal induced crystallization using different metals [J]. Thin Solid Films, 2004, 451-452:334-339.
. Hiroshi K, Isao T, Atsushi K, et al. Ge-fraction-dependent metal-induced lateral crystallization of amorphous Si1-xGex(0≤ x≤ 1)on SiO2 [J]. Appl. Phys. Lett., 2003, 83(13):2148-2150.
. Sadoh T, Toko K, Kanno H, et al. Nucleation-controlled metal-induced lateral crystallization of amorphous Si1-x-Gex with whole Ge fraction on insulator [J]. Jpn. J. Appl. Phys., 2008, 47(3):1876-1879.
. Hellberg P E, Zhang S L, Peterson C S. Work function of boron-doped polycrystalline SixGe1-x films [J]. IEEE Electron Device Lett., 1997, 18(9):456-458.
. 邹晓,徐静平,李艳萍,等. SiGe沟道pMOSFET阈值电压模型 [J]. 固体电子学研究与进展, 2006,26(2):148-156.
. Lee W C, King Y C, King T J, et al. Investigation of poly-Si1-xGex for dual-gate CMOS technology [J]. IEEE Electron Device Lett.,1998, 19(7):247-249.
. Salm C, Klootwijk J H, Ponomarev Y, et al. Gate current and oxide reliability in p+ poly MOS capacitors with poly-Si and poly-Ge0.3Si0.7 gate materials [J]. IEEE Electron Device Lett.,1998,19(7):213-215.
. Lee W C, King T J, Hu C M, Observation of reduced boron penetration and gate depletion of poly-Si0.8Ge0.2 gated PMOS devices [J]. IEEE Electron Device Lett.,1999,20(1):9-11.
. Knaepen W, Detavernier C, Van Meirhaeghe R L, et al. In-situ X-ray diffraction study of metal induced crystallization of amorphous silicon [J]. Thin Solid Films, 2008, 516 (15):4946-4952.
. 孟志国,郭海成,吴春亚,等. 125 mm彩色AMOLED的多晶硅TFT基板 [J]. 半导体学报 ,2006,27(8):1514-1518.
. 金仲和,王跃林. MILC超薄沟道多晶硅薄膜晶体管 [J]. 电子学报 ,2001,29(8):1068-1071.
. Elena A G, Wayne A A. Study of dynamics and mechanism of metal-induced silicon growth [J]. J. Appl. Phys., 2001, 89(8):4648-4656.
. Lee S B, Choi D K, Lee D N. Transmission electron microscopy observation of Cu-induced directional crystallization of amorphous silicon [J]. J. Appl. Phys., 2005, 98(11):114911-1-(1-7).
. Pereira L, Barquinha P, Fortunato E, et al. Influence of metal induced crystallization parameters on the perfor-mance of polycrystalline silicon thin film transistors [J]. Thin Solid Films, 2005, 487 (1-2):102-106.
. Kim K H, Kim A Y, Park S J, et al. Electric-field effect on metal induced crystallization of amorphous silicon [J]. Thin Solid Films, 2004, 451-452:320-323.
. 黄金英,赵玉环,张志伟,等. Ni金属诱导非晶硅(a-Si:H)薄膜 [J]. 液晶与显示 ,2005,20(5):397-400.
. 金仲和,王跃林. 金属诱导非晶硅横向结晶机理研究 [J]. 电子学报 ,2001,29(8):1079-1082.
. Jang J, Park S J, Kim K H, et al. Polycrystalline silicon produced by Ni-silicide mediated crystallization of amorphous silicon in an electric field [J]. J. Appl. Phys., 2005, 88(5):3099-3101.
. 廖燕平,邵喜斌,吴渊,等.用金属诱导-准分子激光晶化法制备多晶硅薄膜 [J]. 液晶与显示, 2005,20(2):128-131.
. Park K C, Lee J H , Song I H, et al. Poly-Si thin film transistors fabricated by combining excimer laser annealing and metal induced lateral crystallization [J]. J. Non-Crystalline Solids, 2002, 299-302(part2):1330-1334.
. Brendel K, Nickel N H, Lengsfeld P, et al. Excimer laser crystallization of amorphous silicon on metal coated glass substrates [J]. Thin Solid Films, 2003, 427 (1-2):86-90.
. Lin Y D, Wu Y S, Chao C W, et al. Effects of oxygen on the growth of Ni induced lateral crystallization of amorphous silicon films [J]. Mater. Chem. Phys., 2003, 80(3):577-580.
. Kim H Y, Choi J B, Lee J Y.Effects of silicon-hydrogen bond characteristics on the crystallization of hydrogenated amorphous silicon films prepared by plasma enhanced chemical vapor deposition [J]. J. Vac. Sci. Technol. A, 1999, 17(6):3240-3245.
. Haque M S, Naseem H A, Brown W D. Aluminum-induced crystallization and counter-doping of phosphorous doped hydrogenated amorphous silicon at low temperatures [J]. J. Appl. Phys., 1996,79 (10):7529-7536.
. Ashtikar M S, Sharma G L. Silicide mediated low temperature crystallization of hydrogenated amorphous silicon in contact with aluminum [J]. J. Appl. Phys., 1995, 78(2):913-918.
. Maugis P,Hopfe W D,Morral J E,et al. Degeneracy of diffusion paths in ternary, two-phase diffusion couples [J]. J. Appl. Phys.,1996, 79(10):7592-7595.
. Wang J Y, He D, Zhao Y H, et al. Wetting and crystallization at grain boundaries:Origin of aluminum-induced crystallization of amorphous silicon [J]. J. Appl. Phys., 2006, 88:061910(1-3).
. Kishore R,Shaik A,Naseem H A,et al.Atomic force microscopy and x-ray diffraction studies of aluminum-induced crystallization of amorphous silicon in Al/α-Si ∶ H/Al, and Al/α-Si ∶ H/Al thin film structures [J]. J. Vac. Sci. Technol. B, 2003, 21(3):1037-1047.
. Radnoczi G, Robertsson A, Hentzell H T G, et al. Al induced crystallization of a-Si [J]. J. Appl. Phys., 1991, 69(9):6394-6399.
. Hentzell H T G,Robertsson A,Hultman L, et al. Formation of aluminum silicide between two layers of amorphous silicon [J]. J. Appl. Phys. Lett., 1987, 50(14):933-934.
. Hiraki A. A model on the mechanism of room temperature interfacial intermixing reaction in various metal-semiconductor couples:what triggers the reaction? [J]. J. Electrochem. Soc., 1980, 127(12):2662-2665.
. 祁菁,金晶,胡海龙,等. Al诱导a-Si:H薄膜的晶化 [J]. 真空科学与技术学报, 2005,25(1):57-60.
. Nast O, Hartmann A J. Influence of interface and Al structure on layer exchange during aluminum-induced crystallization of amorphous silicon [J]. J. Appl. Phys., 2000, 88(2):716-724.
. Nast O, Wenham S R. Elucidation of the layer exchange mechanism in the formation of polycrystalline silicon by aluminum-induced crystallization [J]. J. Appl. Phys., 2000, 88(1):124-132.
. Schneider J, Klein J, Muske M, et al. Depletion regions in the aluminum-induced layer exchange process crystallizing amorphous Si [J]. Appl. Phys. Lett., 2005, 87:031905(1-3).
. 段鹏,屈新萍,刘萍,等. Ni诱导非晶SiGe结晶 [J]. 半导体学报, 2004,25(11):1453-1457.
. Wang G W,Ru G P, Qu X P, et al. Schottky contact properties of Ni/n-poly-Si0.87Ge0.13/n-Si (100) heterostructure [J]. Mater. Lett., 2004, 58(15):2082-2086.
. Jarmar T, Seger J, Ericson F, et al. Morphological and phase stability of nickel-germanosilicide on Si1-xGe<em>x under thermal stress [J]. J. Appl. Phys., 2002, 92(12):7193-7199.
. Gjukic M, Buschbeck M, Lechner R, et al. Aluminum-induced crystallization of amorphous silicon-germanium thin films [J]. Appl. Phys. Lett., 2004, 85(11):2134-2136.
. Gjukic M, Lechner R, Buschbeck M, et al. Optical and electrical properties of polycrystalline silicon-germanium thin films prepared by aluminum-induced layer exchange [J]. Appl. Phys. Lett., 2005, 86(11):062115(1-3).
. Hekmashoar B, Shahrjerdi D, Mohajerzadeh S, et al. Low-temperature stree-assissted germanium-induced crystallization of silicon-germanium alloys on flexible polyethylene terephtalate substrates [J]. J. Vac. Sci. Technol. A, 2004, 22(3):856-858.
. Masaki Y, LcComber P G, Fitzgerald A G. Solid phase crystallization of thin films of Si prepared by plasma-enhanced chemical vapor deposition [J]. J. Appl. Phys., 1993, 74(1):129-134.
. Kim H Y, Kim B, Bae J U, et al. Kinetics of electric-field-enhanced crystallization of amorphous silicon in contact with Ni catalyst [J]. Appl. Phys. Lett., 2002, 81(27):5180-5182.
. Jang J, Oh J Y, Kim S K, et al. Electric-field-enhanced crystallization of amorphous silicon [J]. Nature, 1998, 395:481-483.
. Zeng X B, Wang H J, Sun X W,Li J F. Electric field-enhanced metal-induced lateral crystallization and p-channel poly-Si TFTs fabricated by it [J]. Microelectron. J, 2008, 39(10):1189-1194.
. Murakami H, Ono K, Takai H. Effect of electric field on silicide formation [J]. Appl. Surf. Sci., 1997, 117-118:289-293.
. Jun S I, Yang Y H, Lee J B, et al. Electrical characteristics of thin-film transistors using field-aided lateral crystallization [J]. Appl. Phys. Lett., 1999, 75(15):2235-2237.
. Izmajlowicz M A T, Flewitt A J, Milne W I, et al. Directional nickel-induced fielded aided lateral crystallization of amorphous silicon [J]. J. Appl. Phys., 2003, 94(12):7535-7541.
. Choi D K, Kim H C, Kim Y B. Mechanism of field-aided lateral crystallization of amorphous silicon [J]. Appl. Phys. Lett., 2005, 87(6):063108-(1-3).
. Miyao M, Kanno H, Sadoh T, et al. Electric field assisted low-temperature growth of SiGe on insulating films for future TFT [J].Proceedings of SPIE,2008, 6984:L9840-L9840.
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