Effect of Packaging Technology of ACF on Interconnection Property

ZUO Jian-dong; LUO Chao-yun

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Effect of Packaging Technology of ACF on Interconnection Property

Device Technology & Physics | 更新时间：2020-08-12

- Effect of Packaging Technology of ACF on Interconnection Property
- Chinese Journal of Liquid Crystals and Displays Vol. 24, Issue 4, Pages: 537-540(2009)
- 作者机构：
  
  1. 深圳大学材料科学与工程学院
  2. 深圳职业技术学院应用化学与生物技术学院,广东深圳,518055
  3. 深圳市特种功能材料重点实验室,广东深圳 518060,E-mail: jdzuo@szu.edu.cn
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN406;TN405.97
- Received：08 January 2009，
  
  Revised：02 January 1900，
  
  Published Online：30 August 2009，
  
  Published：30 August 2009
- 稿件说明：
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左建东;罗超云. 组装工艺对ACF互连性能的影响[J]. 液晶与显示, 2009,24(04): 537-540

ZUO Jian-dong;LUO Chao-yun. Effect of Packaging Technology of ACF on Interconnection Property[J]. 液晶与显示, 2009,24(04): 537-540
左建东;罗超云. 组装工艺对ACF互连性能的影响[J]. 液晶与显示, 2009,24(04): 537-540 DOI：

ZUO Jian-dong;LUO Chao-yun. Effect of Packaging Technology of ACF on Interconnection Property[J]. 液晶与显示, 2009,24(04): 537-540 DOI：

摘要

总结了异向导电胶膜(ACF)的组装工艺对ACF导电性能的影响。文献表明在ACF组装过程中

组装的温度、压头的压力和加热时间对ACF的固化程度有直接影响

进而影响到ACF互连的力学性能、电学性能和可靠性。合适的组装温度在180~200 ℃;不同的组装形式均有其最佳的组装压力;ACF胶的互连电阻在87％固化程度时最小;固化程度小于50%

出现短路的概率较大

达到25％;随着偏移程度的增加

ACF的互连电阻增加

导电粒子的形状对偏移产生的绝缘电阻影响更大。

Abstract

Effect of packing technology on the interconnection property of anisotropic conductive film (ACF) was discussed. The References showed that in the procession of packaging of ACF

pressure of discharge head

heat temperature and heat time have an important effect on the degree of curing. Moreover these parameters further affect the mechanical property

electric property and reliability of ACF. The appropriate packaging temperature is between 180 ℃ and 200 ℃

and the different packaging form has the optimal pressure. The resistance of ACF is minimal when the curing degree is 87%. When the curing degree is smaller than 50%

the probability of short circuit can reach 25%. The resistance of ACF increased as the offset improved. The shape of conductive particles has an important effect on insulation resistance caused by offset.

关键词

Keywords

references

. 吴靓平. 细节距各向异性导电胶及其互连可靠性 [J]. 环球SMT与封装 ,2003, 3(2): 4-5.

. Wu F S,WU Y P,Wu B Y,et al. Shear strength of fiip chip pakaging bonded with anistropic conductive film [J]. Chin. J. Semiconductors,2004, 25(3):340-345.

. Wu Y P, Alam M O, Chan Y C, et al. Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages [J]. Microelectronics Reliability, 2004, 44 (2):295-302.

. Tan S C, Chan Y C, Chiu Y W, et al. Thermal stability performance of anisotropic conductive film at different bonding temperatures [J]. Microelectronics Reliability, 2004, 44 (3):495-503.

. Uddin M A, Alam M O, Chan Y C, et al. Adhesion strength and contact resistance of flip chip on flex package- effect of curing degree of anisotropic conductive film [J]. Microelectronics Reliability, 2004, 44 (3):505-514.

. Yin C Y,Alam M O,Chan Y C,et al. The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications [J]. Microelectronics Reliability,2003,43 (4):625-633.

. Chan Y C,Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly II. Different bonding pressure [J]. Microelectronics Reliability, 2002,42 (8):1195-1204.

. Kim Jong-Woong, Jung Seung-Boo. Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process [J]. Materials Science and Engineering:A, 2007, 452-453 (15):267-272.

. Kim Jong-Woong, Moon Won-Chul, Jung Seung-Boo. Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection [J]. Microelectronic Engineering, 2006, 83(11-12):2335-2340.

. Cao L Q, Lai Z H, Liu J. Effect condition of adhesion strength and ACA flip-chip curing contact resistance //Proceeding of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China:IEEE,2004:254-258.

. Chiu Y W, Chan Y C, Liu S M. Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects [J]. Microelectronics Reliability, 2002, 42 (12):1945-1951.

. Fan S H, Chan Y C. Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications [J]. Microelectronics Reliability,2002,42 (7):1081-1090.

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