Optimization of low-temperature vertical alignment process and substrate compatibility for flexible liquid crystal dimming films

CHEN Ruisi; GUO Xintao; LIU Ying

doi:10.37188/CJLCD.2026-0004

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Optimization of low-temperature vertical alignment process and substrate compatibility for flexible liquid crystal dimming films

Device Physics and Device Preparation | 更新时间：2026-09-20

- Optimization of low-temperature vertical alignment process and substrate compatibility for flexible liquid crystal dimming films
- Chinese Journal of Liquid Crystals and Displays Vol. 41, Issue 3, Pages: 344-352(2026)
- 作者机构：
  
  中国航空制造技术研究院非金属材料技术研究所，北京 100024
- 作者简介：
- 基金信息：
- DOI：10.37188/CJLCD.2026-0004
  CLC： TN141.9
- CSTR：32172.14.CJLCD.2026-0004
- Received：09 January 2026，
  
  Revised：2026-02-10，
  
  Published：05 March 2026
- 稿件说明：
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CHEN Ruisi, GUO Xintao, LIU Ying. Optimization of low-temperature vertical alignment process and substrate compatibility for flexible liquid crystal dimming films[J]. Chinese Journal of Liquid Crystals and Displays, 2026, 41(3): 344-352.
DOI：

CHEN Ruisi, GUO Xintao, LIU Ying. Optimization of low-temperature vertical alignment process and substrate compatibility for flexible liquid crystal dimming films[J]. Chinese Journal of Liquid Crystals and Displays, 2026, 41(3): 344-352. DOI： 10.37188/CJLCD.2026-0004. CSTR： 32172.14.CJLCD.2026-0004.

摘要

针对柔性反式液晶调光膜制备中，传统垂直取向层高温固化与柔性透明导电基板耐温性不匹配的问题，开展低温垂直取向工艺优化与基板适配性筛选研究。在玻璃基板上以120~140 ℃、5 ℃步长研究低温垂直取向剂固化温度对液晶预倾角及其均匀性的影响，并分析取向层固化前后基板透过率与雾度变化；在最优固化温度下引入摩擦处理改善取向质量；进一步通过

曲线测试验证取向层的电场响应，并开展室温存放与电压循环以评价取向层稳定性；最后在统一工艺条件下对5种商用柔性透明导电基板进行方阻热稳定性及取向层固化

前后的透过率/雾度变化对比，筛选适配基板。当固化温度由120 ℃升至140 ℃时，预倾角均值由0.69°降至0.38°且标准差由0.30°降至0.04°；在140 ℃基础上摩擦处理可将预倾角进一步降低至约0.19°，并同时降低雾度。液晶盒

曲线呈现明确的电场驱动响应（

≈8.69 V，

≈14.06 V），室温存放30 天后预倾角变化约0.02°且电压循环前后参数稳定。基板筛选结果表明，f3型聚对苯二甲酸乙二醇酯/氧化铟锡（Poly（ethylene terephthalate）/Indium Tin Oxide， PET/ITO）膜在140 ℃热处理后方阻基本稳定，且取向层固化后透过率维持在约90%，雾度变化较小，综合表现优于其他样品。本研究确定了适用于柔性调光膜的低温垂直取向工艺温度，并在统一工艺条件下筛选获得与取向层兼容性较好的柔性透明导电基板，为柔性反式液晶调光膜的工艺迁移与材料选型提供实验依据。

Abstract

To address the mismatch between the high-temperature curing required by conventional vertical alignment layers and the limited thermal tolerance of flexible transparent conductive substrates in flexible reverse-mode liquid-crystal （LC） dimming films， a low-temperature vertical alignment process and substrate compatibility screening were investigated. On glass substrates， a low-temperature vertical alignment agent was cured at 120~140 ℃ with a 5 ℃ step to evaluate the effects of curing temperature on LC pretilt angle and its uniformity， together with the variations in transmittance and haze before/after curing. A rubbing treatment was further introduced at the optimal curing temperature to improve alignment quality. The electro-optical response of the aligned LC cell was verified by voltage-transmittance （

） characterization， and stability was assessed via room-temperature storage and voltage cycling. Finally， under the same processing conditions， five commercial flexible transparent conductive substrates were compared in terms of sheet-resistance thermal stability and the changes in transmittance/haze after alignment-layer curing， aiming to identify compatible substrates. As the curing temperature increased from 120 ℃ to 140 ℃， the mean pretilt angle decreased from 0.69° to 0.38° and the standard deviation decreased from 0.30° to 0.04°. With rubbing at 140 ℃， the pretilt angle was further reduced to 0.19°， acc

ompanied by a decrease in haze. The LC cell exhibited a clear threshold behavior in the

curve （

≈8.69 V；

≈14.06 V）. After 30-day storage at room temperature， the pretilt change was ~0.02°， and electro-optical parameters remained stable after voltage cycling. Among the tested substrates， the f3-type PET/ITO showed the most stable sheet resistance after thermal treatment at 140 ℃ and maintained a high transmittance （~90%） with limited haze variation after curing， outperforming the other candidates. A low-temperature vertical alignment processing window suitable for flexible LC dimming films was established， and a compatible flexible transparent conductive substrate was identified under unified conditions， providing practical guidance for process transfer and substrate selection of flexible reverse-mode LC dimming films.

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